Electronics Forum | Fri Jun 18 04:15:27 EDT 1999 | Frank
I would like to carry out a survey of all the available flipchip bump metallurgies available with the compatible bond pad finishes and compatible substrate attachment methods. The results will be posted on this forum. Your input will be very much app
Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M
| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure
Electronics Forum | Tue Sep 22 14:33:47 EDT 1998 | David Brooks
I am looking for a way to re-bond a flexible circuit to a PWB, so that the original circuits are re-connected. Can anyone help? I believe I saw some equipment in SMT Magazine 1 or 2 months ago, but I can not find that advertisement!
Electronics Forum | Tue Sep 01 16:47:42 EDT 1998 | Wayne Bracy
| -Ben Huunting isn't my number one sport, so can't say much about it...just good luck. Only reason we fish so much is to give my boys some bonding time, at least that's what I tell the wife.. Wayne
Electronics Forum | Thu May 28 16:04:32 EDT 1998 | Igmar Grewar
Is there someone who can tell me where I can buy rolls of leader tape for SMT component tapes. Is there a good way of bonding leader tapes, maybe a special instrument to do the job. Thanks for any help.
Electronics Forum | Tue Aug 21 22:24:36 EDT 2001 | davef
Root around here http://www.kns.com/resources/library/lib-wirebonding.asp
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Wed Aug 14 03:14:39 EDT 2002 | lloyd
Thanks for the replys'. So are you saying that SMD adhesive contains a flux agent?, because at this point in the process the boards have no solder on them at all, it's all done at a solder bath after the chips have been bonded.
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