Electronics Forum | Wed Mar 10 20:13:23 EST 1999 | Earl Moon
For Dean and the rest of you interested, I have reconciled many of my thermal issues with this machine and its peculiarities. The bottom side heater seems adequate, at 750 watts (not going to spend 10 grand extra for 500 more watts no matter what) a
Electronics Forum | Thu Nov 12 03:58:10 EST 1998 | Earl Moon
| What are the factors that go into determining PCB Board temperature requirements for the Wavesolder process? Most of the recipes I've seen call for preheating the PCB to around 230F - 250F. This temp is about 210F - 230F below the typical solder te
Electronics Forum | Mon Aug 27 15:50:05 EDT 2001 | seand
Hello Everyone, The MPM UP 3000 may be a good bet for your Screenprinting application and I am aware that there are a few in inventory at Speedline Technologies (MPM) that you should be able to get with a warranty for a good price. I know wide vers
Electronics Forum | Fri Oct 26 11:29:41 EDT 2001 | kaopsahl
I have two DEK 288s set up in our shop, we used to use a Fuji GSP_III. I could not possibly say enough good things about the DEKs - they are incredible. The only real complaint I have with them is that if an error pops up that locks up the software -
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Tue Apr 01 09:03:39 EST 2003 | kmorris
Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these critters. The part we are using is a Semtech SH3000
Electronics Forum | Thu Aug 28 16:13:06 EDT 2003 | Dan Gosselin
Thanks everyone for your help. I have since found a good article I am downloading of of the SMTA website. Dan Title : EFFECT OF SURFACE TENSION OF SOLDER ON UNDERSIDE DEVICE SUPPORT DURING REFLOW OF A PCBA Author : Mulugeta Abtew Author Company
Electronics Forum | Mon Dec 08 18:52:47 EST 2003 | Craig M
Stability of process is what your measuring so lets not assume a stable process(if your process was perfect you would have no defects). With no test a medium complexity board will be around 68.7% (according to Consulogic). I dont have many other sour
Electronics Forum | Mon May 09 12:26:17 EDT 2005 | stepheniii
If followed, would the following strategy meet the requirements of IPC/JEDEC J-STD-033A; All MSD components are either exposed for less than 1/2 an hour or final reflowed within 12 hours of opening. What I mean by exposed is any time the parts are n
Electronics Forum | Mon May 16 18:03:30 EDT 2005 | davef
Key Issue: Will this machine solder your boards? You never know until you solder one. Any other avenues of analysis involve substantial risk. Flux Selection * High or low solids * VOC or VOC-free Solder Alloy * If using lead-free, avoid stainles
