Electronics Forum | Wed Sep 05 07:07:25 EDT 2007 | mun4o
hi, I have a big problem with soldering uP QFP144 package.All components in PCB are small, only this chip is big and I can't make good temperature profile.Solder joints of other components are shining and with good wetting, but in QFP leads solder j
Electronics Forum | Thu Sep 13 17:29:02 EDT 2007 | fnorradd
I am currently having a problem with uncut legs on one side of axial components from a universal dual head insertion machine. Initially it was thought that the anvil on one side was engaging slow so I stripped down and changed the seals in the botto
Electronics Forum | Mon Jan 12 02:45:53 EST 2009 | sachu_70
Hi Stefano, Although your concept of Wave soldering such devices is possible, I would look at an alternate solution. An easier way would be to Reflow solder all Bottom side SMD components with solder paste, followed by wave soldering for only through
Electronics Forum | Wed May 09 17:26:57 EDT 2001 | davef
Awww, don beso tuff on ursef!!! It sounds like you�re thinking correctly with what you�ve done, but it�s possible that the test you ran did not represent your actual production environment as well as you would have liked. So, you just need to "cran
Electronics Forum | Fri May 11 15:43:41 EDT 2001 | davef
More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the board (ie, thickness, type, solder ma
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Thu Sep 02 14:42:52 EDT 1999 | JohnW
| We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | After wave solderin
Electronics Forum | Tue Sep 07 12:51:02 EDT 1999 | Brad Kendall
| | We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | | After wave so
Electronics Forum | Wed Jul 20 14:56:29 EDT 2005 | CLampron
The mount plane is not the same every time. Our machines are conveyorized and the bottom rail is fixed so the mount plane does change with the board thickness. The stand alone table has a V notch for holding the board with the flat edge on the bottom
Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist
Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the
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