Electronics Forum: bottom (Page 201 of 231)

Flason SMT Products

Electronics Forum | Wed Oct 03 23:42:32 EDT 2018 | gaintstar

SMT Reflow Oven Factory http://www.flason-smt.com/product/SMT-Reflow-Oven-Factory.html Introduction of SMT Reflow Oven Factory: 1. Windows XP platform, user friendly interface and easily swap between bilingual of English & Chinese. 2. Digital contr

QFN Rework Issues

Electronics Forum | Tue Feb 12 09:12:37 EST 2019 | SMTA-Joe

Hello SMTA. I'm having issues reworking QFNs inside housings with a much higher thermal mass than any typical PCB. We have had demonstrations in-house using BGA rework stations that simply don't get the job done. The problem is threefold: 1) th

Please Help: Pace TF 1800 or Finetech CorePlus

Electronics Forum | Tue Apr 02 07:12:38 EDT 2019 | jchris

I worked with a PACE TF1800 for about a month on a project last year and it performed flawlessly for BGA and QFN installations and removals. It can handle boards up to 12"x12". Really easy to use with excellent profiling software that walks you throu

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg

I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some

Koh Young Fiducial error multi-up panels

Electronics Forum | Mon Jun 10 14:10:08 EDT 2019 | griinder

I am able to create a single board program using gerber and centroid, and teaching footprints. I can then assign 2 global fids(a third never seems to display in Ceditor), and export my pad file. I then open it in ceditor and export the job file. Load

Help required selecting reflow oven

Electronics Forum | Thu Jun 27 03:03:57 EDT 2019 | SMTA-David

Hi, I have a small assembly line that consists of a Semi-Automatic Stencil machine, a Samsung Pick and Place, a small IR reflow oven and a wave soldering machine. The reflow oven is presenting the biggest bottleneck. The machine is a small IR (T960

Rad 5 performance: bent lead

Electronics Forum | Mon Jul 08 18:45:53 EDT 2019 | assuredtech

Would you happen to have the Jig used to check that the component itself is in spec with UIC's general specifications? 1.) Component in spec. 2.) Correct 2.5mm pusher on the feeder / dispense head. Also set the conditioner guide where the comp enter

Quad QSV-1 - Several TEP1 faults during Startup

Electronics Forum | Thu Aug 08 11:04:48 EDT 2019 | btfonseca

Hi everyone, I was recently trying to troubleshoot a bad floppy driver on our QSV-1, which actually worked, I was able to read floppy drives but for some reason it all went downhill when one of the green LED's turned off and another red LED turned on

Wave soldering - black residue / bridging

Electronics Forum | Fri Dec 27 12:42:36 EST 2019 | rgduval

In your video, it looks to me as though the bottom of the glass is too low, but, I can't tell for certain. As a general rule, keep the top of the wave no higher than the mid-point of the PCB. Top flow will take care of itself thanks to flux and cap

solder ball

Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto

Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.


bottom searches for Companies, Equipment, Machines, Suppliers & Information