Electronics Forum | Thu Jun 23 12:59:09 EDT 2005 | jdumont
That was a great article. Luckily for us we dont build at the wafer level. Only PCB assembly through surface mount and wave. I like the positive pressure idea. Im going to contact the HVAC guy and see what he thinks. I think that just being in a clos
Electronics Forum | Mon Jun 27 10:45:31 EDT 2005 | franciscoioc
Thank's for the information Bob. I have another question, at the moment my peak reflow is at 218c, this means I am above the 210c a lot of companies run off. If I am building boards using SN63/37 solder paste with lead on my process, and using lead f
Electronics Forum | Tue Aug 02 22:51:21 EDT 2005 | crishan
It is difficult to verify our current state. We are building a new factory, I am trying to push to have one common ground. But some old timers prefer to have the electrical ground seperate to the ESD ground. I will check if we decide to have it in
Electronics Forum | Mon Aug 22 15:15:59 EDT 2005 | PWH
Can I please get some opinions on the best way to kit/present parts to the SMT line for high mix/low volume board manufacturing? We currently kit builds using a scrap rate assigned to different package sizes. It is O.K. but could use some refinemen
Electronics Forum | Fri Sep 23 04:38:34 EDT 2005 | Rob
Hi, We used the 1 mil for 0402's etc. Admittedly most of our experience was on 2.6 & 4 mil as we mainly used the GSM's for oddform & fine pitch, but we found that the smaller chips went down better & more accurately with the smaller camera. Oh yeah
Electronics Forum | Thu Oct 06 21:32:37 EDT 2005 | Ken
Exactly. Also consider how customers are begining to dabble in LF and want to use the same FABS for concurrent builds. The don't want to add or modify any PCB artwork and pay for NRE changes. And they don't want to keep two part numbers for the sa
Electronics Forum | Fri Oct 14 15:55:16 EDT 2005 | nuezmaster
Thanks Rob, I have samples and production quantities that we are running on leaded assemblies now. I guess my next question would be, if you are already building lead-free assemblies, how are you processing the electrolity and tantalum caps? The o
Electronics Forum | Tue Nov 01 08:50:26 EST 2005 | James
I've recently been subjected to a procedure that requires the first 2 solder paste prints of a production run to be wiped down and not used for the build. This is to condition the stencil aperture walls? and insure good print deposition. Is this a
Electronics Forum | Wed Nov 16 04:57:21 EST 2005 | rlackey
Hi, Sorry to bore you all with more ROHS stuff but... As part of the ROHS/leadfree changeover we're left with one type of component where we are getting mixed messages re-exemption. Is there a list anywhere which details parts that are exempt
Electronics Forum | Fri Nov 18 08:19:41 EST 2005 | Rob
Thanks for that. It's definitely a tricky one, with lots of yet to be confirmed exemptions. It's particularly confusing with this type of product as it is said to be up for exemption due to lead in the glass of the erase window. However, does this
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