Electronics Forum | Wed Jun 09 11:41:25 EDT 2010 | smtmax
Hi Danny, I would suggest a laser-cut stencils w/ anti static polymer film. For more information on the stencil you should consider engineering lab. They provide high quality stencil for a reasonable price. If you can find a laser-cut stencil for a
Electronics Forum | Wed Jun 16 11:49:55 EDT 2010 | tim_wright
A customer wants to coat a no-clean assembly to cut cost and cycle time. I know what wave flux I can use to make it work, but the Indium SMQ92J paste we use causes dewets. Any other no-clean pastes out there that play nice with acrylic?
Electronics Forum | Wed Jul 07 11:40:32 EDT 2010 | daxman
Huh... Can you maybe explain a bit more? Are you getting this error on the IP3 monitor or on the programming computer? Do you use MCS, Fuji Cam or Flexa? Will the machine start up and zero-set? At which point of the power-up does the error arise? Are
Electronics Forum | Fri Jun 18 12:33:02 EDT 2010 | bob2000
Davef, Thanks for the reply. I do not know if a radial capacitor needs to be secured with adhesive. The board in question is a class 2 device where high reliability needs to be achieved. I can not find any book references where adhesive application i
Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o
Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea
Electronics Forum | Tue Jul 06 10:08:20 EDT 2010 | swag
Thanks - we have tried everything you can imagine with machine settings as well as burnishing and flatening fids with irons. I don't want to deal with it in house. The volumes are huge and we don't want to do any touch-ups. I am really looking for
Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam
I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the
Electronics Forum | Mon Jul 12 15:36:47 EDT 2010 | namruht
Thanks Reese. Right at the moment we haven't ran into big capacity issues, but I can foresee it coming if we continue to grow. I was just looking for some other opinions from everyone as to how they handle process complications with older equipment.
Electronics Forum | Mon Jul 12 07:47:41 EDT 2010 | rgduval
Talk to your paste manufacturer, they can recommend a reflow profile (as well as advise the paste activation temperature, and liquidous reflow points. The ENIG finish should not affect your reflow parameters any more than the solder paste. Typicall
Electronics Forum | Tue Jul 13 05:21:04 EDT 2010 | bubbobbed
Guys, I've received complaints from customer that the chip is sticking on the cover tape or carrier tape when detape. Is there any possible that i can solve the problem by changing the cover tape or carrier tape?? some say the root cause of this issu
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