Electronics Forum: can (Page 1431 of 2421)

Moisture Sensitive Devices

Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron

10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store

BGA rework station

Electronics Forum | Tue Jun 15 15:57:00 EDT 2004 | russ

I have used one in the past and wish I had one now. Is that enough input? We had great success with this machine. The large lower preheat and board supports worked very well for large thin boards. We never experienced any problems with this machi

MPM AP-20 drivers

Electronics Forum | Mon Jul 26 21:56:53 EDT 2004 | pdeuel

The camera is not driven from the motor cards. The camera is attached to what is called a forcer. For the Y axis there are two of them. One is wired backwards from the other. one of the forcers is connected to a flex chanell for the air and electrica

MPM AP25 Calibration

Electronics Forum | Tue Jul 27 19:02:46 EDT 2004 | pdeuel

Not an easy task and requires calibration jig. MPM support field service is your best bet. The adjustment screws for the prizm located on left side of camera will adjust the x direction. There is a set screw on the front that must be loosened first.

repairs on a through hole 4 layer board

Electronics Forum | Thu Jul 22 04:28:05 EDT 2004 | ouch

Hi, I'm new here, but I have a problem that I don't see discussed. I am trying to repair a Zilog Z80 Encore Board. these boards use 4 layers. you can see the board here on page 11: http://www.zilog.com/docs/z8encore/devtools/um0151.pdf I have bough

SMT Machines

Electronics Forum | Fri Jul 30 05:21:04 EDT 2004 | vinitverma

I would also like to add some more features of Assembleon XII platform. You had mentined that you already have GSM machine whose feeders could be used if you buy a new GSM machine. Assembleon XII machines such as Opal XII, can use GSM feeders as we

Crystalized Flux under BGA

Electronics Forum | Wed Aug 04 00:17:41 EDT 2004 | Shean Dalton

Additionally, increases in temperature can increase the water's rate of reaction with the flux. Sometimes, only a 5 degree change can make the cleaning difference. If the flux inconsistently presents itself, then the likely cause is something in

Lead Free ...

Electronics Forum | Tue Aug 31 22:03:30 EDT 2004 | KEN

If you have control over your design (as in an OEM) ENTEK can be a managable alternative. IF your like me (a CM), you get one of everything ever imagined. There has been much ado with ENTEK. Not every product is apropriate. For instance I have cu

lead free platings and tin lead

Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN

I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f

PBGA vias throwing solder balls

Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol

During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,


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