Electronics Forum | Fri Dec 13 12:56:57 EST 2002 | kmcneeley
I've seen this type of problem before. You need to get on your bare board vendors. It's a process problem for them. When you add the heat in reflow or wave solder the vias open. I'd get the vendor involved and reject the bare boards. There is still a
Electronics Forum | Fri Dec 13 19:01:14 EST 2002 | Tooling Guy
I have heard of people using tiny lead-shot filled bags to hold down thru-hole components on circuit boards while running through a wave solder machine on selective solder pallets. How successful has this been? What kind of material is being used f
Electronics Forum | Sat Dec 14 15:25:31 EST 2002 | MA/NY DDave
Hi To me, something seems wrong with your process. I have never had to do what you are suggesting, yet I can imagine your difficulty with fluffy (easily floating) components. I won't give all the technical details, instead I would ask you to have
Electronics Forum | Wed Dec 18 12:04:53 EST 2002 | slthomas
That issue (gasketing is what I usually see it called) was the driving force behind us getting new printers. Our old semi-auto clamshells just weren't repeatable enough, particularly over changes in squeegee travel direction. If the paste in the
Electronics Forum | Thu Dec 19 13:10:49 EST 2002 | gramsey
Really? Where does it say that? I have had the opposite experience and 3.2.2 from the IPC-7525 states for square or rectangular apertures - "Having a radiused corner for all apertures can promote stencil cleaning". It actually recommends circular ape
Electronics Forum | Thu Dec 19 14:29:03 EST 2002 | mark
It sounds like the stencil wasn't polished. Most stencil sources that only offer laser cut stencils do not have the electro polishing chemistry because they don't want to deal with the waste treatment issues. I suggest you verify that the stencil is
Electronics Forum | Thu Dec 19 14:29:06 EST 2002 | mark
It sounds like the stencil wasn't polished. Most stencil sources that only offer laser cut stencils do not have the electro polishing chemistry because they don't want to deal with the waste treatment issues. I suggest you verify that the stencil is
Electronics Forum | Thu Dec 19 12:08:01 EST 2002 | davef
Facts!!! I got facts. Mechanical strength experiments of Sn43/Pb43/Bi14: �Microstructural And Mechanical Characterization Of 43/43/14 Tin/Lead/Bismuth�; J. Marshall, J. Calderon, J. Sees; Soldering And Surface Mount Technology; 10/91, p25-27 Look
Electronics Forum | Tue Dec 31 01:58:19 EST 2002 | MA/NY DDave
Hi Sorry, even though I have seen a machine in action by a test engineering department years ago, and remember some advertisements since then, and maybe have seen one at a show, I don't remember the names of the companys. If I had to I could probab
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
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