Electronics Forum: can (Page 541 of 2421)

Removal of No-Clean flux residue

Electronics Forum | Fri Sep 07 21:43:40 EDT 2001 | mugen

Hi, We use IPA and Prozone, if IPA is so drastically detrimental, to the pcba's.....what suggested alternative, can you please recommend, as IPA replacement? Thanks.

Stainless Steel in wash system

Electronics Forum | Wed Sep 12 20:46:10 EDT 2001 | davef

Dunno, but if I had to guess, your DI is corroding the stainless. But then again, some saponifier concentrations can be overly caustic

Minimizing Tombstoning Defects

Electronics Forum | Mon Sep 17 10:09:45 EDT 2001 | martys

What variables that you have tested are sensitive to producing tombstoning defects and what advice can you provide to minimize them?

reflow profile

Electronics Forum | Fri Sep 21 11:02:37 EDT 2001 | davef

You can measure temperatures any place that you would like, but the issue is the temperature of the solder. We've seen solder temperatures that vary from lead to lead on the same component. Why don't you want to measure the temperature of your so

reflow profile

Electronics Forum | Wed Sep 26 14:48:01 EDT 2001 | bobm

there is a company called EFD. my contact there is john kaminski. they have thermocouples that are spring loaded requiring no solder at all. they work great. you attach them to the edge of the board and you can move the end to make contact where you

Large Board Assembly

Electronics Forum | Mon Sep 24 05:50:23 EDT 2001 | dwoon

Has anyone used or had any experience with Fuji & Quad for large board assembly? What is the maximum board size that a Fuji & Quad can support? Many thanks in advance.

Publication chance!!! If you have some real-world data...

Electronics Forum | Wed Sep 26 09:01:38 EDT 2001 | hinerman

I'm afraid I only have data that has been published previously. What I do have was created when working for other companies and can not be shared, sorry. Perhaps someone else may be able to help. Regards Jay

Component Text (Fonts)

Electronics Forum | Tue Oct 02 20:47:30 EDT 2001 | davef

There is no standard that describes component part marking requirements. Component fabricators take different approaches to marking. The major marking methods are: * Laser * Epoxy * No marking Maybe with this as a starting point, we can discuss yo

reversing Heller conveyor travel

Electronics Forum | Mon Oct 08 14:56:10 EDT 2001 | Mike

I think the problem is going to be the cooling zone location. All of the heat zones are built the same, but the cooling zone can not be moved easily.

SMT process consultants

Electronics Forum | Wed Oct 10 07:21:47 EDT 2001 | roland

Ken, A pretty decent list of consultants can be found at: http://www.astm.org/consultants/NEW/subjectarea.html . I hope this helps! Roland


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