Electronics Forum | Mon Jan 09 17:35:32 EST 2006 | russ
How are people getting BGAs reworked on boards that are 15"x15" at .06" thick? The BGAs are pretty much in the center of these assemblies. We have just received these and I cannot keep from warping/bowing as much as 1/2" at the heated area. Our bot
Electronics Forum | Mon Jan 09 19:09:45 EST 2006 | Mike
Basically the same exact way as a much smaller board. The only difference is the profile. Most of our boards are 0.063" thick. Looks like you found your problem. If the edges of the board are cold relative to the rework site (high difference in t
Electronics Forum | Mon Jan 30 10:21:05 EST 2006 | CEB
Just recently installed new machine with Hawkeye 400, the vision system is extremely easy to set up and run. We have only been running but 6 weeks, but I would recommend the system versus the cost of a inline solder paste inspection systems. If you i
Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95
Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.
Electronics Forum | Fri Feb 10 12:33:36 EST 2006 | russ
We do something quite simple that may or may not be adequate but I cannot think of why it would not be adequate. If anybody can please inform. We have a large board about the samer width as our oven. We have dedicated thermocouples on this board a
Electronics Forum | Tue Feb 14 09:30:42 EST 2006 | cyber_wolf
Pardon me for being so bold, but I still cannot understand to this day why solder paste thawing is an issue. I am not sure what types of paste you all are using but it has been my experience that the only thing you gain by refrigerating is 3 months
Electronics Forum | Fri Feb 24 08:29:25 EST 2006 | davef
Step stencils are not widely used, due to: * Higher cost as compared to uniform thickness stencils * Danger of solder paste smearing at least close to the steps * Difficulty of cleaning the stepped stencil underside (the steps cannot be on the upper
Electronics Forum | Thu Mar 02 08:37:15 EST 2006 | walbone
Thank you very much. I swapped the component length and width measurements in Autoprogram and it now places the SOT23's with image verification no problem. As for the 0402's I am still working on this. Pick and place is very new to me, well I start
Electronics Forum | Tue Mar 28 17:10:25 EST 2006 | mikecollier
I unfortunately cannot post any photos, the unit in question is classified. And, as far as my comment that the BGA profile can be manipulated, if an engineer is also working the process with one of the operators, they can override the profile at any
Electronics Forum | Tue Apr 25 16:42:00 EDT 2006 | russ
Sometimes you gotta do what you gotta do! We have to perform this on occasion as well. We perform this when we cannot get a board to stay free of tacoing, oilcanning, sagging or warping. (we needed a bigger preheater dimension wise) We have one no
