Electronics Forum | Wed Mar 28 11:53:50 EST 2001 | Steve
Take the leap of faith my friend!! Buy the AOI and watch all of your problems disappear. Okay, so I exaggerated a bit. Let me tell you the real story. We purchased a CR Technology RTI6500 almost two years ago. We chose the CR Tech unit because it wa
Electronics Forum | Wed Apr 11 00:17:03 EDT 2001 | Dreamsniper
Hi, We got a 0.5mm pitch QFP144 from Altera with the below lead width specs. min. lead width = 0.17mm nominal = 0.22mm maximum = 0.27 What's the best pad or land width for the above? This is what our designer used. Land Width = Component Lead Wi
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Wed Apr 25 16:08:24 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:09:45 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:12:18 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Tue May 01 12:16:25 EDT 2001 | kaoni
I really appreciate your advice. Dave did not offer much in the way of real advice, his response was mostly diatribe. I am looking at visual inspection at this time as AOI might be overkill in my case. I believe that it, in combination with the machi
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis
So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free
