Electronics Forum | Wed Jul 05 11:44:04 EDT 2006 | Rob
We had one mechanical engineer from a certain customer telling us we had to crop components leads so they didn't protrude through the board, as they could then come in contact with the case as the board was flush. Had I have known then what I know
Electronics Forum | Thu Jul 20 23:44:41 EDT 2006 | reypal
Thanks Darby for your comment and absolutely agree with you. What we are trying to define here is a KPI for throw out. but before that, we need to get a guideline or standard as reference. in this case, if no any industry standard then we can use cur
Electronics Forum | Fri Oct 06 15:43:33 EDT 2006 | Mario Scalzo, SMT CPE
What I usually do is keep the peak temperature about 5-10 deg C below the peak temperature of my lowest rated component, then set everything else up around that. Worse case scenario is to just extend the time above liquidus (TAL) in 5 second increme
Electronics Forum | Thu Oct 12 09:22:12 EDT 2006 | charless
Hi We are experiencing different failure modes between leaded and lead free through hole assemblies. The boards are PTH. In the case of lead free boards we are seeing fracturing of the component legs much earlier than we do with leaded assemblies. N
Electronics Forum | Mon Oct 16 15:46:24 EDT 2006 | slthomas
The wording in your second post re: lead vs. lead free behavior seems to contradict your first post, but I'll assume you mean that the lead free boards fail sooner during vib. testing. My question is, if this is the case, are the parts that are fai
Electronics Forum | Wed Oct 25 09:59:06 EDT 2006 | slthomas
"Many manufacturers charge to register their equipment prior to selling parts or providing service." True, but in most cases those fees might actually net something you can't get somewhere else, like some technical expertise. C'mon, it's not like th
Electronics Forum | Tue Nov 07 10:16:20 EST 2006 | kevinp
The touch down sensor is probably the culprit, however make sure the head is not impacted with old solder paste and that the cylinders that flip the head are functional. I have had problems with one of the cylinders not functioning this caused the he
Electronics Forum | Fri Oct 27 07:39:54 EDT 2006 | jdumont
Just wondering if anyone has seen this problem before. We are using a 456 ball FPGA and during installation on our BGA rework machine the corners curl up causing opens there. The part was profiled with our KIC and matches the paste MFG spec. Is this
Electronics Forum | Sat Nov 11 22:43:50 EST 2006 | KEN
Hey Sr. Tech. Before you get crazy with changing the process or chemistry I would first verify you are using the correct mix ratio. A refractometer can be a useful tool in these cases. I have seen this in the past where the maintenance technician
Electronics Forum | Tue Nov 14 08:17:09 EST 2006 | Rob
Degassing - the air in the void above the electrolyte expands, or in some cases the electrolyte vapourises, blowing the top of the cap from the base. Sometimes electrolyte can also leak out around the base seal. This is also a failure as the cap wo
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