Electronics Forum: casing (Page 86 of 247)

Baking Components ?

Electronics Forum | Fri Jul 30 16:43:28 EDT 1999 | Dreamsniper

Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce solder

Re: HSP 4796 Chip Shooter

Electronics Forum | Wed Feb 23 11:40:38 EST 2000 | TMV

I would definitely check the amount of adhesive/paste that you are putting on the board. It may not be enough for any moving table application. If you think you are OK there, lets go on. As you probably are aware, the HSP tact times can be independan

Re: What???

Electronics Forum | Fri Jun 18 15:35:53 EDT 1999 | M Cox

| | | Anyone at Nepcon East or in the Boston area who could answer a few question about assembly equitment and SMT manufacturing, on the afternoon of 6/17 - please e-mail me before noon. | | | $100 for your answers. | | | | | Sounds like it's ...

hybrid solder joints

Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis

I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin

Re: registration

Electronics Forum | Tue May 04 12:26:13 EDT 1999 | Clifford Peaslee

Wade, Posting into the SMT Forum does not require registration, yet in order to post into the PCBCE Mart, Library, or News, you must be registered. In the case of News, you must be registered with a company account. Also, we have always required reg

Re: Stencils Universal?

Electronics Forum | Tue Mar 23 09:30:35 EST 1999 | Dan Hughes

Nancy, The mounting hole locations in most standard frames are the universal in both the screen and stencil industry, more over some of the newer machines clamp the frame in place. Most printers are very adjustable this way. If you were using a "qu

Re: Adhesive dispension

Electronics Forum | Mon Mar 01 23:57:00 EST 1999 | Erhan Kaya

"DIP, VCD" -> "smt secondary" type of process flow. In that case, dispensing becomes a must. Dispensing needs less setup than printing, but takes longer. So, for a prototype manufacturer, dispensing becomes the best choice. Sometimes a machine dispe

Re: SMD mounting method

Electronics Forum | Fri Feb 05 04:18:44 EST 1999 | Joni Siipola

| Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via holes to the

Board Stress

Electronics Forum | Tue Jan 19 12:25:23 EST 1999 | Mike Cox

I need some opinions (And I know everybody has one). I am mounting a board into a case, after mounting the board I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" direction.

Re: FIDUCIALS

Electronics Forum | Sun Oct 18 00:56:19 EDT 1998 | PARK KYUNG SAM

| I AM LOOKING FOR INFORMATION ON A WAY TO REPAIR STENCIL FIDUCIALS TO KEEP THEM SOLID AND AS DARK AS POSSIBLE.SOMETING THAT WOULD BE MORE OF A PERMANENT SOLUTION,I HAVE USED PERMANENT INK BUT IT EVENTUALY WIPES OFF OR FADES... HELLO MR NATE. I WO


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