Electronics Forum: casing (Page 96 of 247)

High Volume BGA re-balling

Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen

Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:

Recomendations? Fuji CP7 or Univ HSP4797?

Electronics Forum | Mon May 24 19:37:07 EDT 2004 | marcelll

Hi Grant, you have 2 good machines there. Thing to remember: Fuji machines need an external controller to run (Fuji cam or Flexa), you will have to buy that (extra cost). HSP have is own firmware include. HSP can do pick-up correction both in X and Y

PCB Supports

Electronics Forum | Thu Jun 10 16:21:43 EDT 2004 | Charlie

Guy,s I do not have Red-e-set, but Grid-lok offers a fully automatic system that easily installs onto the printers and P&P. It can be set to your board instantly by pressing one button or triggered by the printer to set for each consecutive PCB. They

Fuji CP6 Feeder Problems

Electronics Forum | Fri Jul 16 08:05:44 EDT 2004 | cyber_wolf

In case anyone is interested, I found a solution to the problem. The 3 nylon rollers that the overlay tape rides on have a tendency to build up crud inside them. They may appear to function correctly when there is no overlay tape pushing on them, but

DRY SOLDERNG

Electronics Forum | Sun Jun 27 11:45:30 EDT 2004 | zhuju

Hi MSK. Unfortunately Your English description isn��t clearly, I don��t understand exactly what problem you are facing, and I only see perhaps solder paste is wrong or contamination from something��������.. Would you like to description your ca

BGA open joint

Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN

Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka

cracked capacitors at SMT 1&2

Electronics Forum | Tue Aug 17 10:37:45 EDT 2004 | M.Enright

Some cracks are really obvious,straight down the middle of the capacitor.Some are slight hair line fractures which fail at ICT.In all cases seen,all cracks are through the centre of the cap.My worry is that there may be some which have fractures and

Ion exchanger

Electronics Forum | Thu Sep 02 22:07:28 EDT 2004 | davef

It depends. We've known cases where 10 mohm-cm was insufficient and others where 0.1 mohm-cm was more than sufficient. No standard exists. Our final rinse is fed from a recycling unit that produces DI water. We use 0.5 mohm-cm resistivity as the lo

Soldermask Defined BGA Pads

Electronics Forum | Fri Oct 15 09:11:39 EDT 2004 | mattkehoe

Hi Justin, Thanks for the feedback. We are inspecting with the naked eye. Most of what we do are prototype quantities, in this case 6 pcs, so AOI or measurement equipment has never seemed justified. The release looked uniform during the printing a

Wireless wrist strap

Electronics Forum | Tue Oct 19 09:26:51 EDT 2004 | HOSS

Arman, We introduced wireless wrist straps here on a small scale for safety related jobs such as mass lead trimming. These straps operate by the "Corona" effect which, as it turns out amounts to this: You need to drink a case of that swill to conv


casing searches for Companies, Equipment, Machines, Suppliers & Information