Electronics Forum | Wed Sep 20 10:00:40 EDT 2000 | Erick Russell
Yes, some testing of soldering chip capacitors onto ceramic substrates with high temperature paste proved successful. Die attachment can be achieved using this technology as well. The underfill of the die becomes a critical factor in rework potentia
Electronics Forum | Mon May 07 17:59:07 EDT 2001 | davef
One thing I forgot to add about the globs of solder on your bottom side SMT components after wave soldering: The excess solder is likely reducing the reliability of these components, because of the difference in CTE betweeen the ceramic base on the
Electronics Forum | Wed Feb 02 09:58:00 EST 2000 | Dave
Ashok, I don't understand what they're saying about the gray joint. Usually a gray joint has to do with too much heat. Also, the higher the temperature the lower the fillet because of the increased viscosity of the solder. Correct? Wouldn't yo
Electronics Forum | Mon Dec 27 22:45:58 EST 1999 | Jim
Is there a way to avoid the reliability problems arising from the tce mismatch between ceramic chip smc's and FR4 laminates, without spending an arm and a leg on expensive substrate materials? Are there inexpensive substrates with reasonably compata
Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F
| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde
Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Sat Mar 06 09:50:38 EST 1999 | Dave F
A recent thread ... Pre-heat for Ceramic Capacitors - Igmar 10:21:55 03/04/1999 ... was addressing something that was discussed in an earlier thread. I searched 'til I was ARRRRRRHHHH! without finding the earlier thread. The weird part is: Search
Electronics Forum | Thu Jul 15 12:07:36 EDT 1999 | Mark
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | There are a number of methods available. 4 of them are discu
Electronics Forum | Tue Nov 17 15:27:20 EST 1998 | Barry Kauffman
Can someone please tell me where I might find detailed information on the processing of a double-sided flex circuitry design. I am looking for specifics such as methods of fixturing,printing,placing and reflowing.Things to keep in mind when processin
Electronics Forum | Sun Aug 23 20:24:59 EDT 1998 | Karlin
Hi, Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. We have rule out the possibility of not printing any solder paste there
.gif)
.gif)
