Electronics Forum: ceramic (Page 61 of 74)

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman

| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis

There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======

Re: DOUBLE REFLOW WITH HEAVY WEIGHT PLCC PACKAGE

Electronics Forum | Sat Jul 25 00:09:13 EDT 1998 | Phillip Hunter

Use caution if epoxy is dispensed under the PLCC 84. If the "SMT Gods" look unfavorably onto you rework will be difficult. I had a ceramic PLCC 84 which weighed 15 grams (MCM) and due to packaging failures (glass seal to metal cover) rework was the

Re: Solder paste with BGAs?

Electronics Forum | Thu Jul 23 11:39:16 EDT 1998 | Russ Miculich

Are you using a HASL board or an organic protection on the pads? This will help determine as to whether paste is necessary or just a very active/tacky flux should be used. Tight process control will also help in the reflow oven. Many users don't wan

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne

Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle

Re: Selective Wave Soldering

Electronics Forum | Tue Apr 07 10:01:04 EDT 1998 | Steve A

| Good Morning everyone. Per repeated suggestions I have been reading back issues of SMT and Circuits Assembly magazines. I have just read an article concerning selective wave soldering which I understand is to be used when active SMTcomponents are

Re: Selective Wave Soldering

Electronics Forum | Tue Jan 12 17:46:26 EST 1999 | Tom Gervascio

| | Good Morning everyone. Per repeated suggestions I have been reading back issues of SMT and Circuits Assembly magazines. I have just read an article concerning selective wave soldering which I understand is to be used when active SMTcomponents a

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Mar 24 17:08:52 EST 1998 | Steve Gregory

David, There was a thread going on the IPC TechNet about exactly the same thing... The ratio that was posted is: Less than, or equal to 30-grams per square inch Which means if you weighed a part and it is 30-grams, you'll need .033" of surf

MONSTER board equipment...

Electronics Forum | Fri Aug 24 19:08:17 EDT 2001 | stefo

Happy Friday All! Well, it seems another "opportunity" has presented itself to me. Looking to assemble a 24" X 24", 52-layer board... piece-o-cake, right? Not real sure of all the components that are on it, but I do know that there is some 20-mil

lead substrate materials

Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef

Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on


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