Electronics Forum: cfm (Page 2561 of 7894)

JUKI vs I-PULSE vs MYDATA

Electronics Forum | Wed Nov 21 07:52:15 EST 2007 | avalancher

Hello! You may want to be more specific whereas each of those companies produce different machines. You have basic introductory machines, and high-end machines. Some provide faster speeds, some provide a wider range of component handling.

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 04:48:21 EST 2007 | beta

Hi all, I have never had to run a product with BGAs on the bottomside of a double sided board. I was just wondering if this is a done thing ? or should I stay well clear. any replies appreciated. aj...

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 12:25:52 EST 2007 | realchunks

It can be done. But as Rob states, use edge rail oven. We have a product 18 inches long by 9 inches wide with BGAs on both sides.

laser soldering

Electronics Forum | Fri Nov 23 18:19:30 EST 2007 | g2garyg2

Yes, PROMATION has customer's using laser to solder PCBs. This is too broad of a forum to discuss openly so please feel free to write me at: Gary_Goldberg@pro-mation-inc.com Perhaps I can assist Gary

laser soldering

Electronics Forum | Mon Nov 26 09:45:46 EST 2007 | jseagle

My advice is the technology is not there unless your boards have been designed for laser soldering. Even then there are too many limitations to go into it. We tried a unit for almost a year and were never able to get consistent, not even going to m

laser soldering

Electronics Forum | Mon Nov 26 15:15:05 EST 2007 | realchunks

I agree with James. Granted there are a variety of lasers to try, we too could not get a consistent power setting. Plus when paste turns liquid, you get some reflection. Also the mask around the pad has to be pulled back or burning may occur.

laser soldering

Electronics Forum | Fri Nov 30 11:49:20 EST 2007 | nkb2400

If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS met

SMT BGA capable oven and stencil printer.

Electronics Forum | Mon Dec 03 13:48:38 EST 2007 | mariusro

Hi Krebbe, Why not trying DEK 248 with vision. It's a semiautomatic printer with fully fine pitch capability, works just fine!

SMT BGA capable oven and stencil printer.

Electronics Forum | Mon Dec 03 14:17:38 EST 2007 | valuems

Hello You can give us a call for a printer, if you would like. Call 740-403-9406 Harry

Epoxy application

Electronics Forum | Tue Nov 27 18:31:02 EST 2007 | devgru

I would agree with the above. Epoxy is the way to go. You can have it formulated in different thicknesses and cure times, but you need to watch out for the exothermic heat from the curing.


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