Electronics Forum | Mon Jun 16 19:16:28 EDT 2008 | duchoang
I am using TopazX2, placing 0603 caps with #72 FNC nozzles. Sometimes, there is solder splash around the caps, being blowed out by the nozzle (?) when it placed the part down. Any idea about the reason and solution. Thanks.
Electronics Forum | Tue Jun 17 11:02:47 EDT 2008 | dwelch123
You need to adjust the air kiss. The machine blows a slight amount of air after placement and it is probably adjusted too high.
Electronics Forum | Tue Jun 17 15:00:36 EDT 2008 | duchoang
"The machine blows a slight amount of air after placement and it is probably adjusted too high. " Is that adjustable and how to do it on TopazX2 Assembleon Pick and Place Machine?. Thank you very much.
Electronics Forum | Wed Jun 18 07:48:29 EDT 2008 | gemengr
vo^ cai' tab pick vacuum% set at 30 and tab mount vacuum % set at 30 . neu^' va^n~ con` bi. thi` set lai vacuum cho nozzle #72 in machine data. by the way duyHoang o*? ddau^ zi?? good luck
Electronics Forum | Wed Jun 18 08:07:58 EDT 2008 | davef
Here is a link to a basic discussion of solder mask application methods: http://www.ami.ac.uk/courses/topics/0221_smp/index.html
Electronics Forum | Wed Jun 18 11:53:58 EDT 2008 | edbedie
I need to buy a good copy of the book Electronic Packaging: Design, Materials, Process, and Reliability. Does anyone have one they would sell?
Electronics Forum | Wed Jun 18 15:44:39 EDT 2008 | ampearl
I believe it is short for Oscilloscopes which is used to debug signals. How that relates to SMT I don't know...I am only a recruiter.
Electronics Forum | Wed Jun 18 15:53:08 EDT 2008 | Paul M.
Oh. You mean "Oscope", which is short for oscilloscope. I'd apply, but I'm stuck here in beautiful Colorado. Good luck with your recruiting !!
Electronics Forum | Fri Jun 20 13:53:59 EDT 2008 | ck_the_flip
I googled this and this is what comes up: http://en.wikipedia.org/wiki/Othello I guess Othello was a Shakespeare tragedy.
Electronics Forum | Wed Jun 18 18:24:07 EDT 2008 | jensteele
Does anyone know of an established guideline for thickness requirements? Our smaller pads continue to receive a thicker solder deposition when we measure by the larger pads for process accessibility and vice versa for the larger pads when we measure
