Electronics Forum | Fri Nov 12 07:42:38 EST 1999 | Michael
We are looking for AOI for post solder inspection with short setup times for high mix assembly. Also the solder joint of J-Lead components should be inspected. We found two suppliers for such systems, Orbotech and Viscom. Can anyone help us to det
Electronics Forum | Thu Nov 11 17:04:31 EST 1999 | Michael Parker
I am looking for advice on sourcing a x,y digitizer to create pick and place files, off-line, rather than programming with the machine. I could use original gerber data or create the placement coordinates with the digitizer. Also, references to equip
Electronics Forum | Thu Nov 11 10:51:16 EST 1999 | KenF
Could anyone tell me where I can find some literature/standards describing the dimensions and solder land sizes of all common SMD components available in the market? IPC-SM-782 does provides some but not all. Thanks in advance for any response. Rega
Electronics Forum | Thu Nov 11 13:03:01 EST 1999 | Jeff Sanchez
Thanks John, That's a nice site. It had some good training stuff as well. I had seen a thread here on the forum for this same question and someone posted this link www.practicalcomponents.com . It gives all the package sizes and dementions as
Electronics Forum | Fri Nov 12 16:58:24 EST 1999 | Jeff Price
Charley, I am a Fuji Rep in the midwest. I have several customers that have these units I am sure that they would be happy to talk to you about their experiences with the QP242. Additionally I could put you in contact with the rep in your area and h
Electronics Forum | Thu Nov 18 14:40:18 EST 1999 | John Queen
Hi Charley Having worked on the QP2 for some time now i have my doubts about its versatility,this machine is my opinion a cheaper alternative to the IP3,which is far more accurate and more reliable. I would advise yo
Electronics Forum | Thu Nov 11 05:30:09 EST 1999 | Wolfgang Busko
For me it sounds like to much paste. If it worked in former runs with the same design and stencil look for changes in your printing process, check the volume and shape of your deposit. Redesigning pads and playing with aperture size allowing for mor
Electronics Forum | Wed Nov 10 11:52:50 EST 1999 | Wolfgang Busko
All good points to check. But consider that once you have dross in the pump mechanism it�s hard to get it out quick through normal operation. You might empty the pot and clean it sorrowly to get it out of all corners and parts where it sticks. I had
Electronics Forum | Tue Nov 09 13:20:21 EST 1999 | Dave F
Chuck: Try: 1 WWW.JEDEC.ORG 2 Search "surface mount package" which gives you ... MO-Index INDEX OF MO OUTLINES IN PUBLICATION NO. 95 BY-FAMILY INDEX OF REGISTERED MICROELECTRONIC (MO) OUTLINES (contains description of the content of each file) Goo
Electronics Forum | Tue Nov 09 11:50:33 EST 1999 | Steve Owen Snr prod eng.
We have recently purchased equipment that would probably solve your problem. We are using 1.6mm pcb material 1/3 of which is left unscored. When the pcb is de-panelized there is no damage to any components and we have cut our break time in half.
