Electronics Forum | Thu Apr 01 10:05:32 EDT 2010 | brandenspencer10
Hi, My name is Branden Spencer and I am a jr. engineer at TTM technologies. We are currently having and issue with our wave solder process. We are getting what looks like either solder dross or voiding in our solder joints (through hole and SMT). We
Electronics Forum | Thu Apr 08 14:54:39 EDT 2010 | davef
We can make the numbers come-out looking impressive either way. In real life, our sense is: fully burdened, it is a little less expensive to use a contractor. Now, we're only talking costs. Non-cost factors often end-up putting on the brakes and t
Electronics Forum | Mon Apr 05 17:47:21 EDT 2010 | boardhouse
Hi Deni, X-ray will not be able to see through Power and Grn planes. Your only way to find out is: 1) ask your board supplier to supply stack up used. 2) surface grind layer by layer to validate if it is correct stack up. What is making you think
Electronics Forum | Wed Apr 07 17:03:50 EDT 2010 | duchoang
Hi Mabdalla, Attached is my VIOS file. The board dimension in your file is 285.75(L) x 215.90(W) I do not see the board thickness in your file. The dimension in my file is 192.7(L) x 153.67(W) x 1.8(T) Hope this info would help you a little.
Electronics Forum | Thu Apr 08 07:01:51 EDT 2010 | muarty
Hi, Looking for views and some opinions on the best systems to use to clean pads (particularly BGA) prior to carrying out replacement of parts. I'm thinking of vacuum type desoldering systems. Obviously braid is an option which we currently use, but
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Wed Apr 14 10:24:17 EDT 2010 | fönsi
Hello Does somebody of you have some experiences with ultrasonic detectors in SMT-Production? Is it possible to test quality of solder joints by using a ultrasonic detector similar to non destrucitve crack inspection tests? Is there a manufacturer fo
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Thu Apr 15 10:05:26 EDT 2010 | davef
Why not use the same paste volume as you currently use? Alternately, although we haven't used it in a while, doesn't IPC have a very nice paste volume, aperture calculator that could be used for this? Or is it just a pad size calculator used for
Electronics Forum | Thu Oct 28 15:53:27 EDT 2010 | dwonch
Ok, just to put closure on things I figured I should post the conclusion of this whole ordeal. We've acquired a new BGA rework station that allows us to get away without tenting our vias under the BGAs. This allowed us to change our PCB spec to rem
