Electronics Forum | Wed Feb 14 16:00:50 EST 2018 | cbart
We have used it,, mixed results, cleans well, but can as you would imagine destroy plastic, i've had operators soak product and that caused problems, it also destroys any marking labels. we also use different Saponifiers to remove residues in the pas
Electronics Forum | Wed Nov 22 10:32:46 EST 2017 | itactilum
I need the soft for samsung cp40 lv + i can't find it. reinstall the s.o and I would need the soft. on the other hand it gives me an error that begins to give continuous beeps without stopping and I get the following error message "no sequence fini
Electronics Forum | Sun May 12 15:08:28 EDT 2019 | dunks
Fixed! Someone else on here mentioned disabling the light control in sys.ini, and then the issue I was having was both teach boxes being plugged in( one may be faulty) and sys.ini said only 1 for teach position. I unplugged the rear teach box and now
Electronics Forum | Thu Nov 23 20:01:05 EST 2017 | myke03o
Hi to all experts, Can anyone advice us what solder alloy to use for thermal cycling products. We are facing a lot of issues using normal solder paste SAC305. After thermal cycling the solder is cracking. Any suggestion is welcome. Thanks in advanc
Electronics Forum | Thu Jul 25 18:41:52 EDT 2019 | myke03o
Hi I have solved the issue. The component cracking are the big 1210, 0603 and 0402 capacitors. After studying and testing in many type of solder. The best to use is SnPb and the components are the key - there are component which will tend to expand
Electronics Forum | Sat Aug 03 03:28:16 EDT 2019 | alexeyzb
We use SNPb for such applications (PCBA for aircraft). We tried SAC305 but recieve no good quality, so now only SNPb. If you will find good solution - please write. Because now we have some problems with BGA - no SNPb balls. And need to reball (addit
Electronics Forum | Thu Sep 05 10:15:58 EDT 2019 | SMTA-Richard
There are multiple solder alloy options and we have tested many of them in a consortium project. There also are very specific challenges associated with testing using the -40/150 C profile. This is way too complicated to discuss in a chat room. Se
Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Electronics Forum | Tue Nov 28 10:48:29 EST 2017 | georgetruitt
Some things to look into are the component finish, material and composition of the solder, design of the smt stencil, reflow profile or process atmosphere (N2 or air)also contribute to the solder result. The influence of the PCB itself should be co
Electronics Forum | Tue Nov 28 14:27:05 EST 2017 | emeto
Without the details I will tell you that you have too much paste. PCB Pad is probably way bigger than the contact lead surface of the part, you overprint, and in the oven this solder have nowhere to go and tilts your part. Check datasheet.Cutting sma
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