Electronics Forum: cfm (Page 5221 of 7929)

Re: Cleaning process

Electronics Forum | Wed May 03 20:12:48 EDT 2000 | Dave F

Ernie: I'm guessing your question is a bit far a field for us. I�d guess that 70% of us are no-clean with the remainder focusing almost exclusively on cleaning printed circuit boards. So rather than limiting yourself with us, also consider forums a

Pick and place from bulk case

Electronics Forum | Mon May 01 11:51:24 EDT 2000 | Erhard Hofmann

A while ago I read an article about a machine that can pick up a bulk case and then place components out of it without having to travel to a feeder pick up position in between. I forgot where I read this and who the manufacturer was. Can anyone help

Re: Pick and place from bulk case

Electronics Forum | Tue May 02 01:55:13 EDT 2000 | Erhard Hofmann

You are right, I am looking for a solution to place small components, 0603, 0805, 0402, and similar. The components will be fed by a vibratory feeder and placed onto trays. This is happening in the comp manufacturing stage and the trays are used as a

Re: Pick and place from bulk case

Electronics Forum | Tue May 02 21:01:21 EDT 2000 | Stefan Witte

I forgot to mention the mass placement machine from Nitto. The Nitto machine places all components out of bulkfeeders. Plastic tubes are routed above the feeders pick position and into cavities of a template. The template is made for the pattern of t

Re: Excess capacity

Electronics Forum | Wed May 03 13:57:20 EDT 2000 | Stefan Witte

Mark, I guess while your machine sits idle, it could do boards. While the machine processes boards it breaks down by a certain percentage rate. I would multiply the placement rate with the idle time, multiplied by uptime divided by hundred. 10.000 (

Re: Improve program skill of Fujicam

Electronics Forum | Wed May 03 16:11:07 EDT 2000 | JAX

Jack, No need to get frustrated. There is not an optimization software made that will end up with a program that runs faster than doing the same program manually. There are too many ways to speed up production for the software to consider. Even if it

Wave Soldering No-Clean Bottom-Side SMT

Electronics Forum | Fri Apr 28 13:23:22 EDT 2000 | Chris McDonald

We have had nsome new products come in that require Bottom side wave soldering (SMT). I have SOIC's 1206, 0805 that are Glued then Wave soldered. I have had trouble with bridging and no-clean residue with these pcbs. I have a Econopak 2 SMT two zone

Re: BGA Xray inspection

Electronics Forum | Thu Apr 27 15:26:02 EDT 2000 | D Scott

Ron, I too use a Nicolet NXR 1400i. By using the rotation fixture and offsetting the board, a good BGA solder joint will appear elongated. If you rotate the board away from you the wetted joint will appear to lighten and become flat (looking at the

Re: Silver Thru' Hole

Electronics Forum | Thu Apr 27 10:35:21 EDT 2000 | Russ

Scott, I am a little confused, when you mention "silver thru hole vs. plated through hole what do you mean. A silver "immersion" type finish vs. HASL (Tin lead)on your PCB? Or are you talking about using silver solder to perform intrusive reflow of

Re: SMT PCB prototype

Electronics Forum | Wed Apr 26 22:34:49 EDT 2000 | Eric Chua

1. Verify all the part had load to machine. Get ready for the profile. 2. Run the board with double side tape. Is better to run one board for each machine. 3. Verify all the placement ( missing, misalgnment,etc )and check the value using meter for a


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