Electronics Forum | Mon Oct 18 12:02:06 EDT 2004 | Rob
Hi Guy's, Sorry about this, but yes it's another lead free related question. We are looking at using a Chinese SMD DC-DC Converter in a new design, whilst keeping one eye on the approaching Lead-free issue. The manufacturer claims that these are O
Electronics Forum | Wed Oct 20 15:58:09 EDT 2004 | chezm
Hi, I am looking for someone to repair my Universal Digitizer/Programmer model 6892. I can not get the "@" sign after loading the GEN.exe to UIC and also the X,Y display, over the digitizing table is blank. I think, there is a hardware issue. An
Electronics Forum | Fri Nov 05 17:29:53 EST 2004 | Steve Stach
Most metal stencils today are cleaned with a water based cleaning solution. 3 choices are most typical: (1) Water only for water-soluble paste (2) Water + Organic for rosin and no-clean (low residues. This affords lower temperatures and is easier t
Electronics Forum | Thu Oct 21 13:31:41 EDT 2004 | LarryL
With the current failures of the Medium Power Linear Amplifier manufactured by RFMD (PN: RF2114), can anyone recommend a replacement part. The above part is used in a GPS transmitter, where I only have one recommended part on the part list. The manu
Electronics Forum | Mon Oct 25 11:15:10 EDT 2004 | davef
We assume by "stencil tension" you mean a measurement of how securely [or how tauntly] the stencil foil is held in the stencil frame. If so, we do not know how you would go about making your "30 ~ 50 N/cm" limit measurement when verifying conformanc
Electronics Forum | Thu Oct 28 08:26:40 EDT 2004 | curious
What are the defects you see when the stencil is over 50 n/cm? I can't recall ever seeing a (stencil caused) defect that wasn't a dent, ding or some other physical damage, and I would have a very hard time sending back a stencil that is working fine,
Electronics Forum | Tue Oct 26 03:12:36 EDT 2004 | Joseph
Dear all, Recently our production encountered high SOIC failure during testing after reflow soldering. All solder fillets (side/heel) are acceptable as per IPC standard.The reject samples (SOIC)being sent to IC manufacturer to verify the failure. Fin
Electronics Forum | Tue Oct 26 11:01:54 EDT 2004 | Simon UK
DO you have an xray onsite? One suggestion is to check what you can with that machine, i know it wont be able to magnify to 200nm or something, but it will show any ESD damage to the wire bonds or any major cracks of the silicon die. P.s. Most devi
Electronics Forum | Tue Oct 26 22:24:21 EDT 2004 | KEN
More zones = higher thruput. Is it better to have (8) 12 inch zones vs. (7) 15 inch zones? One thought might be more parts = more cost = more potential for failure. I have a bunch of BTU's with over 12,000 heating hours of combined opertion. I
Electronics Forum | Tue Oct 26 13:45:19 EDT 2004 | vinod
Hi friends I am using Alpha Metal WS709 solder paste. I know the spec for this solder paste. It recommends straight ramp to 220 C at 0.9 degree/sec and TAL 75 sec.So I am looking between around 27-220 temp around 215 second. And time above 183 not to
