Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ
I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component
Electronics Forum | Wed Feb 16 13:21:29 EST 2000 | Dane Stokes
Thanks for all the feed back guys. We are currently using the eraser when running the product in question. Thankfully there are no FP. placements on the product.I'm working with a friend on the matter right now and we are triing to get in touch with
Electronics Forum | Wed Dec 27 17:13:28 EST 2000 | John K.
As part of an Intel erratum, they changed their BGA coplanarity spec from .006" to .008". The package is 23 X 23 partial array, .050"(1.27) pitch, 1.220"(31) square. We apply paste onto BGA pads with a 6-mil stencil. From a process perspective, sh
Electronics Forum | Thu Nov 30 17:49:52 EST 2000 | JAX
Chuck, The smaller the pitch, the more package preferences will lean towards Trays. I would tape everything down to .025", maybe .020". With tape and reel you have fewer chances to place wrong polarity due to excessive part changes. Also part pick
Electronics Forum | Fri Nov 24 01:12:28 EST 2000 | SARRY
Hello! All I am an almost smt biginner. I have a few questions My question is 1. what will be changed to use lead free solder paste in a smt production line? 2. what is the reflow profile for lead free solder paste? Don't just tell me to search th
Electronics Forum | Fri Nov 03 09:20:41 EST 2000 | Roland
Edmund, You can use the search on the left side of any SMTnet page to find Canadian companies. I did a search by changing the dropdown to "companies" and used "canada" as my search term and got 29 results. Please contact me directly if you would
Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg
I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this
Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder
I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil
Electronics Forum | Sat Sep 30 16:39:57 EDT 2000 | Geo
We reseantly considered purchasing the Meridian Series machine but we changed our mind. The reason for that was that Quad does not have to many installations of the Equipment, also the fact that hardly any of their field techs. have much training on
Electronics Forum | Mon Aug 14 13:10:43 EDT 2000 | Casimir Budzinski
HI My board house has asked us to change to E TIN 34 Solderable Immersion Tin we curently use Hot Air Leveling, we do SMT & thru hole and use no-clean flux. If anyone out there knows any thing about E TIN 34 Solderable Immersion Tin good or bad I wou
