Electronics Forum: check (Page 576 of 631)

X7R woes

Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob

Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU

Help me find Manufacturer of XRAY Machine

Electronics Forum | Tue Dec 27 13:58:20 EST 2005 | samir

I think alot of those X-Ray machines out there "over-emphasize" BGA analysis. It'll measure every aspect of the BGA, like size of voids, percent voids, how many voids, cumulative sum of the voids, shape and geometry of voids, statistical distributio

Lead Free Dross

Electronics Forum | Mon Feb 13 22:19:48 EST 2006 | Baer

Hi all, I will do my best to answer questions on MS2 here. I will try to check back at least every other day. MS2 is a new process chemical. It is not an oil or powder. It does not leave a residue; it does not mix with the solder. All SIR testing is

MS2 molten solder surfactant

Electronics Forum | Wed Mar 15 17:37:30 EST 2006 | Dan Feinberg

Greetings all, Dross has no value to the assembler. It actually degrades quality as a clean solder pot provides a more consistent process. Yes, removing dross does remove some metallic contaminates but that is overkill, like throwing away your refrig

Heat guns and component damage

Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks

OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a

does potato can absorbed the solder or lead

Electronics Forum | Fri Jul 14 14:05:55 EDT 2006 | nodlac

Additional to Dave F.... A potato has Iron @ 2.75mg and Magnesium @ 55mg. The leaching of these two meatls could contaminate the solder pot and taint the solder. ----------------------- Additional to my additional..THE SOLDER POT POTATO BATTERY...A p

Fighting solder beads

Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev

Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep

Strange problem with Fuji IP1 stopping

Electronics Forum | Fri Apr 14 03:27:07 EDT 2006 | bvdb

The latest news. We ran another production run for 1-1/2 hours. The IP-1 gave a "memory NG" fault indicator twice after fully completing the first and second PCB's. We've been running the tray speed at 30% but noticed that the speed of the tray ro

Heller Oven blowing parts off reflowing

Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc

Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone

MyData Placement Accuracy

Electronics Forum | Thu May 18 03:30:05 EDT 2006 | Grant

Hi, Guru, you are completely full of crap. I have had three MYDATA machines, and battled with accuracy the whole time we had them. We did every upgrade, and added the latest feeders and line scan cameras. In the end we could not keep the accuracy g


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