Electronics Forum: checking (Page 101 of 631)

Re: IP3 QFP Problems - Has anybody had the same probs?

Electronics Forum | Mon Jun 05 22:40:40 EDT 2000 | Dean

...well, if I had Fuji in on 4 occasions and the problem is not resolved I would wonder what exactly I paid for... Here is what I would do. 1. Run the glass plate program. This will eliminate variables in your production parts and boards. Additi

Re: GSM1 Multi Pitch Feeders

Electronics Forum | Tue May 30 10:17:07 EDT 2000 | g cronin

I thought I saw that there is a retro kit required to supply the proper power to the multi pitch feeders from older machines. Check the Universal web site for info on the multi pitch I think that is where I read about it...

Re: Fibres / threads inside PTHs

Electronics Forum | Tue May 02 11:50:26 EDT 2000 | Dan Foose

The first step in pinpointing the exact source of the fibers is to have them identified. Are they fiber glass, epoxy or flux? Or are they something else? I can help you with this if you want. Check out mfg-answers.com\ .

Re: Programming equipments

Electronics Forum | Thu Apr 20 13:38:50 EDT 2000 | Eric

BP Microsystems makes great equipment, have you looked into a programming service provider instead of buying equipment. Check out... http://www.teklution.com

Re: Connector Insertion

Electronics Forum | Thu Apr 13 17:56:01 EDT 2000 | David C.

Check out Robodyne Corp. We used them at Motorola, had some problems withthe Adept Software end of it, but the machine was capable.

ref: tombstoning on chip capacitors

Electronics Forum | Wed Apr 12 09:20:57 EDT 2000 | C.Long

anyone any ideas how to minimise my DPM as regards tombstoning..i have checked oven profile..appeture size on my stencils..placement machine etc and still problems.???????????

Re: ref: tombstoning on chip capacitors

Electronics Forum | Wed Apr 12 13:25:51 EDT 2000 | Billy G

Chris, is right! Pad geometry is one of the biggest factors of tomb-stoning. Check Pad size against parts size.

Re: ref: tombstoning on chip capacitors

Electronics Forum | Fri Apr 21 14:31:20 EDT 2000 | JACOB LACOURSE

I FOUND THAT ONE OF THE MANY REASONS FOR TOMBSTONING COMPONENTS IS MOISTURE IN SOLDER PASTE. ONE WAY TO CONFIRM THIS IS TO CHECK FOR EXCESIVE SOLDER BALLS AROUND THE PART IF THEY ARE PRESENT THEN YOU MAY HAVE A HUMIDITY PROBLEM. GOOD LUCK!!! JAKE

about solder bridge

Electronics Forum | Wed Apr 05 23:56:02 EDT 2000 | angela

Recently we have serious problem of our 0.5mm pitch QFP solder bridge. I check the viscosity of the Litton Kester paster. It's roumd about 700 is it too low. And do you have god solution about it? thanks alot

Re: about solder bridge

Electronics Forum | Thu Apr 06 07:53:35 EDT 2000 | jacob lacourse

I have also come across this very same problem and found that our screen vendor made a mistake on our screen. Check the thickness of your screen it should be about six thousandths if it's eight thousandths then you are most likely depositing to much


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