Electronics Forum | Mon Nov 12 16:13:48 EST 2001 | davef
Underfill is primarily used in flip chip, CSP attach applications. It is used to balance the differing thermal expansion rates for an organic board, solder, and silicon die. There are a fair number of papers written on this in the SMTA [www.smta.or
Electronics Forum | Tue Dec 11 18:32:30 EST 2001 | edmentzer
Does anyone have experience with different colors of solder mask. I am interested to know if a clear or light color mask is better in the reflow process. Most of the boards we do have a green solder mask. It seems to me that I read somewhere that
Electronics Forum | Sat Dec 15 10:01:59 EST 2001 | davef
USE OF XRAY Xray is not used for testing BGA. Xray is an inspection tool, similar to a microscope. Check the fine SMTnet OnBoard Forum. Gil Zwieg from Glennbrook made some good points. Additionally, search the fine SMTnet Archives, where there�s
Electronics Forum | Sat Jan 05 00:13:16 EST 2002 | Chris Veeneman
I have experienced the same problem with my Mark 3. I found the problem to be the solid state relays in the electrical control panel. Towards the front of the machine below the breaker rails. My oven's computer screen would show all was fine but my
Electronics Forum | Wed Jan 02 13:31:55 EST 2002 | PeteC
The rule-of-thumb is to follow the flux mfg.'s recommended profile to achieve their specified top side PCB temperature before making contact with the wave. Typical top side PCB temps are 100-120deg.C. Your wave contact time should be around 2 seconds
Electronics Forum | Mon Jan 28 07:40:40 EST 2002 | cnotebaert
Yes and Yes, Your solder supplier should recomend a profile (standard profile) in most cases you can follow it. Of course you should be running a thermal profile of each board type to verify it is within the specified temp rang. You should also chec
Electronics Forum | Fri Feb 22 11:49:42 EST 2002 | stimpman
Hi, Have you checked your placements pre-reflow? The most typical cause of a billboard unlike tombstoning is a pick and place issue. Billboarding will usually happen with ( profile/bad pad layout and the most common just poor center placement. I'v
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Thu Mar 07 19:19:41 EST 2002 | dason_c
Ron, you need to check all the thermal couples are in good shape and clean before ask the outside service to do the calibration. After the machine calibrated and I suggest that you run 2 profiles and all the heating zone set at the same temperture,
Electronics Forum | Mon Jul 07 00:33:12 EDT 2003 | praveen
First we have to look in to the current situiation of the SMT line.Is the pick and place machine very old and can not perform consistently. Is the board to be inspected is very dense and have lots of connectors and fine pitch comp.with lots of 0402 c
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