Electronics Forum | Fri Jul 14 16:35:03 EDT 2000 | Dave F
Celia: Ubet. Sorry about the ranting. (It comes with the territory.) I don�t recall any peer reviewed stuff, but I seem to remember a couple of articles on white tin in "SMT" "Circuits Assembly" Magazine (er suppin� like that), but it was probabl
Electronics Forum | Tue Jul 11 15:59:52 EDT 2000 | JohnW
George, I looked at the winkic & profit software and tool's a while ago along with some of the alternatives. No matter what anyone tell's you in the 1st instance you do still need a profile card as what you are doing is comparing the known good prof
Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea
Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all
Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko
Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have
Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko
Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez
Electronics Forum | Fri Jun 02 17:19:56 EDT 2000 | Big K
I am currently experiencing several problems with QFP's on one of our IP3's. The first problem is with QFP240 devices. We are experiencing a high reject rate with these parts when using vision type 100. What appears to happen is that the vision syste
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Sat May 20 16:12:21 EDT 2000 | Earl Moon
Kathy, I couldn't not get involved here. A question of particular interest not in the normal vein or type. Wow! Good to see from you again even on the SMTnet. I still appreciate the help you gave on the DEK Proflo issue about two years ago. I just
