Electronics Forum | Sat May 06 06:19:36 EDT 2017 | rob
You could also try some of the 3D MID placement machines - some have dispense heads in with the placement heads, so theoretically you could place on the PCB paste, dispense on the terminals. and place the new part. Yamaha/I-Pulse do a couple: https:
Electronics Forum | Fri May 19 09:53:40 EDT 2017 | deanm
We machine place the first part, then add two dots of dispensable solder paste to the top of the terminations, then hand place the second part on top of the first. Reflow. It works better than hand soldering after reflow. The solder paste is dispens
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Tue Jan 11 13:12:58 EST 2011 | methos1979
Has anyone had any luck programming using the side cameras to inspect for defects on the sides of chip components? We recently had an escape of a damaged chip capacitor that was impossible to see from the top camera but was clearly visible with the
Electronics Forum | Tue Dec 21 00:10:00 EST 1999 | Edmund
Currently i am producing a board using dloble reflow process. The bottom side is mostly 0603 chips and some SOIC. The top side is mostly QFP and some heavy component. During the double reflow process , the capacitor chip on the bottom side drop(same
Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F
Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma
Electronics Forum | Thu Jun 28 11:51:24 EDT 2007 | mika
Hi, Are we talking about the pick-up tolerance so for any chip component set it to 0.5mm. It will save a lot of trouble right there. As for body tolerence if it is a zero then it will automatically use a standard value, based on the size of the body
Electronics Forum | Tue Nov 03 03:29:20 EST 2020 | astarotf
Hello everyone. I would like to know opinions about which is the best SMT machine (pick and place) on the market, for smd electronic manufacturing, to put 0201 chip-type components up to large packages, such as coils, capacitors, soic16-, QFN, BGA et
Electronics Forum | Thu Sep 03 12:40:11 EDT 1998 | Aselco electronics
We are writing to have information about the automatic mounting process of flip-chip. We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). Thanking you in a
