Electronics Forum | Mon Oct 23 02:37:02 EDT 2017 | directx995
Hello, I'm looking for a friendly suggestions or best practices for creating Component Database. For example how do you discern different types of SOIC8, with different body size and pitch between leads? How do you categorize and name components? An
Electronics Forum | Fri Jun 05 19:20:25 EDT 1998 | Rin
| Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. | Here's what we are in the market for: | Low/Mid volume 3,000+cph machine that can handle high j
Electronics Forum | Thu May 28 21:13:09 EDT 1998 | skhun
| Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. | Here's what we are in the market for: | Low/Mid volume 3,000+cph machine that can handle high j
Electronics Forum | Mon Apr 09 10:16:14 EDT 2007 | davef
Pick and place: * Fuji: The largest pcb size is 20" by 18" for pick and place; 18"x14" for chip shooters. Fuji NP XL series allows 27 by 23 inch boards using a conveyor. * MYDATA has machines that can be configured to 34" X 44" X 0.500" * HSP 4796A a
Electronics Forum | Thu Jul 01 16:02:45 EDT 2021 | willkillum
Greetings. Make sure the calibration/homing chip is still with the machine and not lost, although you can buy a replacement from Juki for a not-so-nominal fee. Also, have the seller power it up and bring up the Laser image display/edge check. If ther
Electronics Forum | Fri Jul 02 03:51:14 EDT 2004 | HARAN
I was told by my boss that the new product will be transfered to my facility will have the Super BGA and Hyper BGA.Can I know what is the difference of these 2 components compared to normal BGA.Is there any difference in the assembly process and requ
Electronics Forum | Thu Jul 07 07:27:10 EDT 2005 | buchi79
Are you buying nozzles from UIC or other vendor? By the way, what is the component you rejecting? Is it happening to random component or specific one?
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Mon Oct 23 07:10:14 EDT 2017 | emeto
For packages, you use packages names.There is only one SOIC8. The other 8-lead devices are there and it is your job to learn their names. For components descision should be made based you your whole(part number)system.
Electronics Forum | Mon Mar 22 16:29:42 EDT 2021 | dan_ems
Hello, can anyone help me with a visual dump activation solution for all components? The purpose is to store many images of the components locally during assembly. Thanks!
