Electronics Forum | Thu Sep 17 10:18:54 EDT 2015 | huske
What model do you have? Are you working with a Midas only or Hydra as well? Are you looking for basic information on how to get started with chips and SO's? Or like how to use auto-teach or manually measuring parts and programming or more like select
Electronics Forum | Thu Feb 16 05:49:28 EST 2017 | endruw18
Hello everyone.Ihave an Intel 855pm Northbridge and when i removed the chip,i lifted 4 pads one of them is VSS so i dont care it but the 3 other is:HI 4 ,HI8 and HI 6 (hub interface for cmos i/o or simply hub interface ).Are the vital or only testing
Electronics Forum | Tue Jul 19 03:06:42 EDT 2016 | ishwarsingh1
Upside down placement of a crystal oscillator is acceptable or not ?? As per IPC 8.3.2.9.2 Rectangular or Square End Chip Components – 1, 3 or 5 Side Terminations.I am not sure whether is applicable for crystal oscillator or not . Your answer wo
Electronics Forum | Thu Aug 11 12:45:42 EDT 2016 | anhsang38
Dear All I have a question for the reflow machine. I'm using Vitronics(Mr933+)reflow. The peak temperature of the (Chip, LED, SOT) component higher than (QFP,LGA) about 4 degree when i measured proflie. All of them on the same board . I don't know w
Electronics Forum | Tue Sep 20 13:10:24 EDT 2016 | ladmo1
Have you encountered this? There is black plastic from underneath the chip - oozing out between some of the solder. Like the part melted from underneath. It wasn't even under the chimney and had no direct heat on it. I am afraid if I try to remove
Electronics Forum | Thu Jan 19 11:10:13 EST 2017 | rgduval
I'd start by checking the manufacturers documentation, and seeing if they have any application notes regarding reflow recommendations for the part. But, in general, make sure to bake the parts prior to assembly, they are notoriously moisture-sensiti
Electronics Forum | Wed May 03 02:23:11 EDT 2017 | Rob
Many years ago (20+) we did this by preassembling the 2 parts into a mini leadframe with high temp solder paste, which was a pain but then they could be dropped in trays, surface mounted and hit the line clean. I'm guessing you have a low value cap
Electronics Forum | Mon Jun 05 10:42:28 EDT 2017 | philc
I guess it all depends on volume. If you are talking thousands of PCB's, then automation is best, if possible. Otherwise, hand-soldering them post-production is the obvious solution. How about bill-boarding them? That way, they would fit on the land
Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm
Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.
Electronics Forum | Mon Jun 05 14:37:55 EDT 2017 | stevezeva
At a past employer we stacked caps and resistors quite regularly. As some have suggested a dispensable paste was used and dispensed by hand and then the stack was placed. At first it was placed by hand, but then we were able to program our Mydata to
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