Electronics Forum | Sat Nov 15 05:08:45 EST 2014 | grimus
Same side (component side) if You give me e-mail I can provide You more pictures. I'm making one stroke with same speed (I'm using closed proflow head and DEK printer). 5 mils thickness stencil. Products requirement - 3 IPC Class (75 % and more fill
Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam
Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V
Electronics Forum | Wed May 06 20:52:26 EDT 2015 | arbpkevin
I have been using my topaz X for about 4 years now and I feel that I am fairly knowledgeable about it, at least the functions of it that I use... I am trying to use the LCS to place some qfp chips on a new product and I have set the whole thing up t
Electronics Forum | Fri May 29 07:17:02 EDT 2015 | anirudh_thabjul
Hiee everyone, I am a Hardware Engineer and also a PCB designer. I am using a Microntroller which is in "CHIP PACKAGE". So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology". So, Can any one suggust 1. whi
Electronics Forum | Fri Sep 09 06:10:03 EDT 2016 | jswatt
the time between SMT & wave should be as short as possible but at a max it is controlled by strictest MSD part, so if you have a part with only a 48hr MSL window then it needs to be with the 48hrs. Can you post images of what you are getting? It may
Electronics Forum | Fri Jun 10 12:48:55 EDT 2016 | deanm
Kyle,thank you for steering me back on track. For relays and connectors I like Tom's suggestion provided you are allowed to add materials to your assemblies. An instant adhesive or perhaps a chip bonder (used in SMT) may work if the preheat is high e
Electronics Forum | Wed Jul 26 10:39:23 EDT 2017 | dontfeedphils
TL;DR: I like internal part numbering systems for passive chips and the like, and keeping MPNs for active components (or components with many variants and/or options that could be easily confused as equivalents). I've always been a fan of internal
Electronics Forum | Mon Oct 23 03:52:32 EDT 2017 | wendymm
Hello guys, I'm a new learner in PCB field. And recently, I have summarized some basic information I learnt on how to arrange the line on crystal oscillator, but I'm not sure if it is right. So I'll write it down below, hope anyone who may read my po
Electronics Forum | Wed Jul 11 06:14:21 EDT 2018 | uzbek
Hello, we are currently designing one device that needs shielding. Under the shield, there is one BGA chip and 0402 components. Now we have a dilemma whether we should go for a one-part shield or two-part shield. We talked with several EMS companie
Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
