Electronics Forum: chip and strength (Page 1 of 24)

Multitroniks, Quad System and Tyco Info

Electronics Forum | Tue Jul 31 22:42:41 EDT 2001 | chip

In the past I have spoken to Multitronics sales reps and looked into the product line. I saw their equipment more suited for a smaller "mom and pop" type shop, I work for a mid size contract house and it wouldn't have come close to meeting my needs.

Re: Adhesive strength specs

Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis

As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold

Component soldering strength ?

Electronics Forum | Mon Jul 30 21:29:34 EDT 2001 | kennyhktan

Hello Michael & All, Thanks for the feedback. Months ago we receive a number of reject concerning one of the 0805 & 0603 chip capacitor mising (with joint remain on pad)and seriously solder joint fracture. From there I had do some investigation

how to measure Adhesive strength

Electronics Forum | Tue May 12 07:26:16 EDT 2009 | emmanueldavid

Jorge, The basic thumb rule to measure Adhesive Strength remains as bonded Chips at Post Reflow should not move around or misplace when Your Thumb Finger try to do so which called as Thumb Force Test. However as Dave stated, there are various Stre

Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Mon Jul 06 20:32:34 EDT 1998 | Chiakl

Hi there, I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? Thank in advandce. rgs, chiakl

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

Hi there, I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? Thank in advandce. rgs, chiakl Chiakl

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson

This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

how to measure Adhesive strength

Electronics Forum | Mon May 11 22:47:45 EDT 2009 | davef

We'd expect that a 0603 in properly cured, in-date code, properly dispensed chip bonder would take 5-8 pounds to push off the board.

voids- leaded and chip components

Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris

Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks

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