Electronics Forum: chip and stuck (Page 1 of 21)

Multitroniks, Quad System and Tyco Info

Electronics Forum | Tue Jul 31 22:42:41 EDT 2001 | chip

In the past I have spoken to Multitronics sales reps and looked into the product line. I saw their equipment more suited for a smaller "mom and pop" type shop, I work for a mid size contract house and it wouldn't have come close to meeting my needs.

voids- leaded and chip components

Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris

Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks

voids- leaded and chip components

Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef

No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi

voids- leaded and chip components

Electronics Forum | Wed Jan 14 08:45:04 EST 2004 | Kris

Thanks Dave Will appreciate if any body has any published information on a study they did for voids in leaded devices Will try to talk to them Dave

voids- leaded and chip components

Electronics Forum | Mon Jan 19 18:49:42 EST 2004 | menglong

we are facing the same problem,and we are looking for some research result about voids.who can help to provide these ones ? any suggestion, pls keep me informed contact me :zhanglg@tpv.com.cn

Conductive Adhesives and flip chip

Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef

Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur

voids- leaded and chip components

Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel

Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)

Conductive Adhesives and flip chip

Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan

HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin

Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 21:42:56 EST 2007 | davef

Very smart, Chunks.

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