Electronics Forum: chips (Page 116 of 260)

Circuit Cam Capability

Electronics Forum | Mon Nov 27 10:37:16 EST 2006 | slthomas

"I have talked with their tech support at CircuitCam and they also indicate that the software does NOT support splitting large programs." I haven't used it but that's surprising. How does it handle a chip shooter next to a flexible placer? Is it jus

BGA crack and strain gauge measurement

Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef

There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear

Strange empty ball on chip component after reflow

Electronics Forum | Thu Nov 30 13:36:27 EST 2006 | realchunks

I think you answered your own question. Try a different lot or mfger of this part. You can prolly get a sample sent over nite and hand place them to verify. Trying to find out why these resistors "explode" when touched with a needle is like findin

How much capacitor offset is acceptable?

Electronics Forum | Mon Dec 18 08:52:57 EST 2006 | russ

You need to get yourself a copy of IPC 610. this has all the specs regrding placement and registration. chip aprts are allowed to have 50% side overhang. the fillet requirements are "evidence of wetted fillet" . I would not know if a cap being 51

PCB finish for compression mount connectors (LGA's)

Electronics Forum | Tue Dec 19 21:23:39 EST 2006 | davef

We'd suggest using your connector supplier recommendations. Some use: * Pad Plating: 20-30 uin Au over 50 uin Ni (You might get away with less gold) * In-Pad Vias: less than half the diameter of the button (for contact-only configurations) * PCB/C

glue size

Electronics Forum | Wed Dec 27 23:04:10 EST 2006 | i want to learn from u

Most of pcb have white/black printing at bottom side of them to indicate the chip location. Normally, this printing are the same location to the place that glue will be mount. My problem are the glue size between the point that have printing and not

4790 replacement

Electronics Forum | Fri Feb 02 14:56:57 EST 2007 | Wagoner

Mimot is another machine that is well suited for prototype runs. It's slower than a chip shooter and it is really a flex placer. You can keep a lot of fixed feeders and it is pretty easy to set up. Operator interface is excellent and programming i

Fuji CP IV specs (ball screw)

Electronics Forum | Thu Feb 22 00:22:53 EST 2007 | J. Pigott

I realize this is a bit off topic but looking at some of the discussion. I expect someone might be able to help. Looking at CP IV ball screws 120" and searched the world over for specs. Lead Outer Diameter TPI backlash resolution typical wear on c

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks

Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem

What to buy

Electronics Forum | Fri Mar 09 14:33:11 EST 2007 | oldsmtdude

I would concur about clean room problems especially with a high mix changeover environment. Paper tape is horribly dusty and just the cover tape pulling away generates a lot of dust. There was a day when everyone said paper was on the way out for


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