Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Electronics Forum | Tue Jul 04 08:04:37 EDT 2006 | davef
The heat from a soldering iron will push raw flux across the surface of the board and into surprising places. It's bad practice to squirt liquid low residue flux on the board during rework, because the portion of the flux that does not get heated pr
Electronics Forum | Wed Jul 26 10:09:42 EDT 2006 | mumtaz
Samir, why do you bring back such idiotic rubbish between two gentlemen that just happen to fall into their presidency? It is not rellavant to the questions at hand. I agree that ultra sonics can clean better but do take longer IMO. As for stencil
Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef
We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette
Electronics Forum | Tue Aug 08 20:42:11 EDT 2006 | John Erickson
Hello all, just wanted to say that I've been using MS2 for 2 months now. Yes, it does eliminate dross. Yes, it is a little messy. However, we've seen a significant drop in our DPMO's on both leaded and lead free process. The solder is so much cleaner
Electronics Forum | Wed Aug 16 13:52:24 EDT 2006 | russ
Oven settings are meaningless here. What does the board see? It is the paste we are concerned about not what the heaters are running at hehe. These solder balls are at the end of pad, which end? under the part or away from the part. I believe you
Electronics Forum | Fri Aug 18 00:23:21 EDT 2006 | umar
Hi SWAG/Rush/Steve, Thanks for your response, Currently I am running with 811 lead paste. Actually this problem not only effect for one assy. I got 700 models runing at my company, but almost 50% of the model I have problem with solder balls issue.
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Thu Aug 24 12:53:56 EDT 2006 | russ
yes, it could have been from all 3 locations. without any detail whatsoever about your process or anythign it is impossible to help!! please check your incoming material prior to processing please check your reflow profile to ensure that max temp
