Electronics Forum: cleaning process (Page 16 of 202)

Flux residues found after assembly process (Clean process)

Electronics Forum | Fri Jan 08 12:27:55 EST 2016 | aqueous

The most common method is a R.O.S.E tester. They have been around for 30 years and are an industry standard for ionic contamination (flux and other residues) testing. Manufacturers include: Zero Ion www.aqueoustech.com Omegameter / Ionagraph http:/

Flux residues found after assembly process (Clean process)

Electronics Forum | Wed Jan 13 12:17:47 EST 2016 | trampacorp

Thanks for your input Michael. Basically the > boards had been go through from washing and even > ionic contamination already. In order to > eliminate or detect the flux residues, is there > any equipment something like a uv lamp that can > dete

Vapor Degreasing. Is it coming back? Is it the better choice for your cleaning process?

Electronics Forum | Tue Sep 17 14:31:17 EDT 2013 | paul_bmc

I am looking for eveyones opinion on this cleaning process. We currently have both inline aqueous and batch for cleaning both water soluble, rosin and no clean fluxes. We have evaluated the vapor degreasing cleaning process and discovered equal if

Solder dross / voids in our wave solder process

Electronics Forum | Thu Apr 01 14:43:26 EDT 2010 | cbart

You say its in both smt and through hole, but, are you waving the SMT parts as well, I assume yes since you think its dross in the joints. Questions: 1- do you have higher mag scopes that you can zoom in a little more to see if these are voids or dr

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881

PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 07:46:14 EDT 2021 | jeremy_leaf

I have tried cleaning the pads. That was our first step. Ultrasonic cleaning in acetone and IPA, and also tried etching in a 10% HCL solution. Our board is definitely achieving the correct temperature.

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 19:08:04 EDT 2021 | emeto

Jerry, just out of curiosity, why can't you use flux? Flux is essential part of soldering and it is there for multiple reasons. Flux we can also clean afterwords - even No Clean.

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 27 21:22:57 EDT 2021 | kwalker

The fact that your cleaning didn't really help reinforces that it probably is oxidation. Cleaning won't remove that.

Vapor Degreasing. Is it coming back? Is it the better choice for your cleaning process?

Electronics Forum | Wed Sep 18 07:04:22 EDT 2013 | davef

That's great Paul. Would you share with us the methods and results of your study of the effectiveness of water versus vapor degreasing cleaning?

To reduce the dross formation in wave soldering process

Electronics Forum | Mon Apr 19 11:36:10 EDT 2010 | baildl632

We installed a fixed distance optical sensor above the conveyor rail and "wired it" throught he machines terminal bus to cut the pump on only when a board was present at the pot. We also installed a timer in line so the pump would only stay on long e


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