Electronics Forum: coating materials (Page 31 of 42)

Re: Fiducial Capture MV2F & CP4-3

Electronics Forum | Sat Aug 22 10:25:11 EDT 1998 | Ben Salisbury

We are using PCBs of CEM3 Material with bare copper fiducials. The whole board is of bare copper with a lacquer coating (Coats brother S2974). The fiducials are of 1 mm diameter bare copper. we use Panasert MV2F as well as Fuji CP4-3. In bo

Re: Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 16:56:19 EST 2000 | Dave F

Ashok: If I was to count, I'd guess there was more than 4 subquestions. Hey, but who's countin' anyway? I have answer (s) "on ESD all related to use of wood in a typical PCB Assembly line:" Before pushing-on, it is only "a typical PCB Assembly li

Re: Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 16:56:19 EST 2000 | Dave F

Ashok: If I was to count, I'd guess there was more than 4 subquestions. Hey, but who's countin' anyway? I have answer (s) "on ESD all related to use of wood in a typical PCB Assembly line:" Before pushing-on, it is only "a typical PCB Assembly li

Re: QFP solder paste volume

Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F

We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Re: Clean before conformal coating?

Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman

Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p

Re: measuring board/assy cleanliness

Electronics Forum | Wed Oct 18 16:33:26 EDT 2000 | Dave F

Mike: An omega meter has very little to do with ion chromatography. * IPC TM-650, 2.3.25B, Detection and Measurement of Ionizable Surface Contaminants is a process control method that washes boards with an isopropanol / water solution and measures

Re: adhesive for ptfe boards

Electronics Forum | Fri Oct 01 13:44:57 EDT 1999 | Scott Cook

Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... Many tahnks Don't know what you


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