Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette
80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder
Electronics Forum | Tue Apr 07 13:29:06 EDT 1998 | Chris Fontaine
I have a need to have a number (approx 20) circuit card assemblies which need to have a silicone conformal coating applied per MIL-I-46058. Are there any facilities which can offer me this service? Thank you, Chris Fontaine (603)885-6839 Sanders,
Electronics Forum | Wed Apr 01 11:35:24 EST 1998 | Big Manny
I've had some field reliability and Accelerated Life Test (ALT) issues with BGAs on Entek coated Cu. > The best results so far are with Atotech coated Gold electroplate finish. > Solderability, for factory process, seems to be as described by Justin
Electronics Forum | Fri Mar 06 09:28:14 EST 1998 | Mike
I will be starting a conformal coating process soon, I am looking for any pointers on 1) Best method for masking components, tape mask, liqued mask 2) Which is best Spray or Dip? 3) Compatiblity with no clean solder paste (flux residue) I have Mil
Electronics Forum | Thu Nov 29 08:16:47 EST 2001 | Hussman
Unless your wave is very, very, very old - you are having your leg pulled. Or someone in your maintenance dept. is a little out of it. Most pre-heaters are already coated to prevent rust. Maybe the coating has flaked away, if so, I'd suggest using
Electronics Forum | Mon Dec 10 21:15:24 EST 2001 | davef
back, fronts, and sleeves. * Record data on each coat tested. Look here [ http://www.esdjournal.com/eosesd/smocks/smocks.htm ], if you think: * Testing is a can of corn. * Detergents don't affect smock performance. * Smocks don't wear-out. * Smock c
Electronics Forum | Wed Mar 27 18:23:01 EST 2002 | kmorris
Does anyone have experience doing conformal coating over Plastic BGA in High-Rel PCB assembly? Is underfill necessary to avoid problems with entrapped air, etc? Our application is a 17x17mm BGA, 256 I/O. We are assembling with a water soluable pas
Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor
davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro
Electronics Forum | Mon Jul 01 16:15:02 EDT 2002 | Matt Kehoe
We are currently trying to gather information pertaining to applying LPI soldermask thicker than normal. The thick coating is necessary for the SIPAD ssd process however, because of the numerous brands of mask and application methods there is no sing
Electronics Forum | Thu Jul 18 21:56:40 EDT 2002 | computer
Hi Dave, I read the same article as you. But that method leaves solder balls in via holes or traces of it remains on the boards. I am using ultrasonic with solvent for cleaning misprint boards. Apprarently, they have adverse affect to the en
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