Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John
John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe
Electronics Forum | Wed Feb 09 21:45:48 EST 2000 | Dave F
Sal: Hey that customer standing around staring at you sound like fun, yeh right!!! Wolfgang makes good sense, but, in addition, I�d like to drill-down on board fabrication (har har har) a little bit (har har har) more. You say the holes are the cor
Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem
We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself
Electronics Forum | Wed Oct 18 16:33:26 EDT 2000 | Dave F
Mike: An omega meter has very little to do with ion chromatography. * IPC TM-650, 2.3.25B, Detection and Measurement of Ionizable Surface Contaminants is a process control method that washes boards with an isopropanol / water solution and measures
Electronics Forum | Sun Oct 01 23:58:55 EDT 2000 | stuartfd
Dear forum types, 1st timer so be good. I have a customer in China using Coates soldermask that in its self is not a problem. The problem is the flux their using, I think,it appears to have a vary high viscosity. The problem they have laid at my door
Electronics Forum | Tue Sep 26 15:48:32 EDT 2000 | Dave Hulbert
I'm a bit confused about reading IPC-275 (I know I should have IPC-2221/2222) but I'm sure they are similar. Anyway, I am doing a: Military, less than 100V, non-conformal coated PCB, External Etch Sec 5.3.1.4 Edge Spacing.. (Pg 61) says use Tabl
Electronics Forum | Fri Sep 22 05:33:59 EDT 2000 | Wolfgang Busko
That "C - it doesn�t matter" choice sounds good because it doesn�t give you a headache when profiling but it gives me a headache when I read the article in the current "newsletter" about profiling where I found this: "If soldering to gold over nick
Electronics Forum | Thu Sep 14 19:44:25 EDT 2000 | Brian W.
I cannot give references to papers, etc, but I can tell you from experience that High Impedance circuits and High Power RF circuits are not something to try no-clean on. For an aerospace customer, I had a circuit that any residue left between two pa
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
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