Electronics Forum | Mon Mar 09 15:03:41 EDT 2020 | davef
snip from https://hackaday.com/2020/03/09/pcb-finishes-hack-chat PCB FINISHES HACK CHAT No comments by: Dan Maloney March 9, 2020 Join us on Wednesday, March 11 at noon Pacific for the PCB Finishes Hack Chat [https://hackaday.io/event/169956-pcb-
Electronics Forum | Thu Feb 10 22:41:20 EST 2000 | Dave F
Russ: Now that�s a good story. Nuff said on the Vegas trip, that explains everything. Especially when you say "it must have something to do with ..." I love WS609. It�s been berry, berry good to me. Intermetalic Layer (IL). A compound formed a
Electronics Forum | Sat Jan 06 10:12:51 EST 2001 | Dave F
Vinyl ESD floor tiles are probably the most expensive approach to "permanent" flooring, about $8 a square installed. VPI and 3M are reputable suppliers. Let me digress on ESD floor "waxes", the earlier poster�s comments are well taken, but the bigge
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
Electronics Forum | Tue Apr 17 13:33:00 EDT 2001 | Kris W
Howdy all! Nothin' up my sleeve!!! While attempting to reflow an RF antennae on std FR4, HASL coated, using no clean paste, in a Research Thermaflo 10, the part sometimes slides on one of the pads (as much as 0.125"). There is a slight amount of w
Electronics Forum | Fri Nov 16 08:10:56 EST 2001 | Matt Kehoe
Hi Dave. Sorry I have not responded. Just as I was getting into this forum activity the company I worked for (past tense) decided not to re join the SMTA and I was cut off. Anyways, you can find most of what you asked for about SIPAD on the Midwest
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
