Electronics Forum: comparing (Page 96 of 153)

Reduced component lead diameters

Electronics Forum | Wed May 03 12:26:30 EDT 2006 | patrickbruneel

This is indeed yet another proof that under impulse of the RoHS directives all norms are flushed down the drain. Bean counters are slowly but surely taking over our industry because they no longer face resistance by form of standards. Even the basic

Is anyone using K100 bar solder? Why or why not?

Electronics Forum | Thu May 11 16:48:57 EDT 2006 | patrickbruneel

In all fairness no one has the answer for you, non of the lead-free alloys has been long enough in use or have supporting long-term reliability data. No matter what alloy you will use, your company will be at risk, that�s why so many exemptions are a

Need help for setting up an assembly line

Electronics Forum | Wed Jun 21 13:06:13 EDT 2006 | Nathan

Dear All, Thank you very much for your advices and comments. I appreciate that. Does anyone have any idea how much the good working condition second hand MY9 will cost? And how does MY9 compare to SMT 2350C in term of cost and performance? Regardin

T tech vs LPKF

Electronics Forum | Tue Oct 10 18:17:13 EDT 2006 | Dave from Ohio

We currently use both machines side by side in our lab now and LPKF is by far the better machine. Both are comparable systems to each other but the T-Tech machine always seems to have problems of some sort and their tech support department isn�t ve

Quad 3c/4c Z-Rod Precautions

Electronics Forum | Wed Sep 20 15:25:15 EDT 2006 | lheiss

Hey All, Thanks for all of your help to date. While running the nozzle height test I noticed that the Z-rod is bent. Probably happened after setting the "X closed loop soft home" back to 50 from 384 which was probably why the nozzle slammed into t

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

DPMO as a metic to qualify a CEM as World Class

Electronics Forum | Wed Jan 17 18:08:51 EST 2007 | John S.

We use a fairly simple system. IPC put out standards 7912A and 9261A to define opportunities. Basicly the "number of components" + "number of solder joints" = "number of opportunities." Some six sigma benchmarking studies indicated "Sigma Level" =

Asahi Viromet Lead Free Paste

Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne

Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (

SMD nomenclature

Electronics Forum | Fri Apr 06 16:17:07 EDT 2007 | pima

Let me just shortly explain why do I open this thread. In my corporation in different plants we use same components at the same machines in different products(Fuji machines). I would like to create kind of global database of shapes ( its in FujiFlexa

Solder wave

Electronics Forum | Tue May 08 09:50:19 EDT 2007 | patrickbruneel

Hi Loco, Good point!! The good old glass plate works just fine as long as the conveyor or carriers have L shaped fingers. A glass plate is usually about a � inch thick (a lot thicker than the actual board). With L shaped fingers the bottom of the gl


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