Electronics Forum: component (Page 1016 of 1144)

Re: Hi-Speed SMT manufacturing

Electronics Forum | Mon Feb 01 17:48:36 EST 1999 | E.

| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All

Re: Hi-Speed SMT manufacturing

Electronics Forum | Wed Feb 17 22:55:25 EST 1999 | Dave Kalen

| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All

Re: Hi-Speed SMT manufacturing

Electronics Forum | Wed Aug 04 01:19:30 EDT 1999 | oscar

| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon

| This is a question for those of you who actually assemble components onto a board. | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean

| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall

Re: Component Packaging Trends

Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach

| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?

Re: Universal GSM/Response No. 2

Electronics Forum | Fri Oct 02 07:26:50 EDT 1998 | smd

I didn't use my real name because I don't want to get bombed with phone calls and emails. We are an OEM looking to put in a SMT line soon. Is this GSM a decent machine? How much does it cost? | | Also and info on decent screen printers and reflo

Re: no-clean process / Got Dendritus Eh?

Electronics Forum | Thu Sep 24 10:19:55 EDT 1998 | Dave F

| i am working on a no-clean process implementation project in a company. i want to change a board to no-clean which had dendrite problems underneath the small resistors on the bottom side(in smt).i want more information on the exact cause of dendrit

Post Script

Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike

| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.

Re: What cause Solder Wicking ?

Electronics Forum | Thu Aug 27 15:40:50 EDT 1998 | Justin Medernach

| | | | | Hi, | | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | | We have rule out the possibility of not p


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