Electronics Forum | Wed May 08 04:46:25 EDT 2013 | mbb
Hello, I want to ask what are causes that could engender rejected components in Panasonic pick and place machine?
Electronics Forum | Thu Jul 04 17:17:00 EDT 2013 | processman
Hello, Hoping for some recommendations for how its best to selective solder clinched PTH components.. We are using Ersa equipment. Problem we are having is some of the leads are holiding `blobs` of solder on their leads. Have tried single dot
Electronics Forum | Thu Jul 04 23:14:20 EDT 2013 | mbeauregard
Does anyone have a printable ruler for measuring smd/smt tape and reel components? I currently have one that measures 2 pitch and 4 pitch but it is small and only measures up to 75 parts at a time. I would like one to also include 8 pitch.
Electronics Forum | Wed Aug 21 06:27:58 EDT 2013 | alexeis
Hi, This is a first step before you enter this info into component library. But this step is optional if you have enter this info before and you have a right tool to check your and simulate PCB manufacture.
Electronics Forum | Mon Aug 26 05:26:11 EDT 2013 | action_101
I thought this thread was about someone wanting a simple guide so they can train their operators on polarity for a wide range of components, not a software package for programming. I am confused, but that happens from time to time.
Electronics Forum | Thu Aug 08 16:13:21 EDT 2013 | rangarajd
Hello All, Are there any documents that list component spacing requirements in terms of DFM/ DFA. I was going through IPC website but wasn't able to find any. Thanks!
Electronics Forum | Fri Dec 13 10:06:05 EST 2013 | davef
For vertical mounted, axial leaded components; the standoff from the land to the component body should be 0.4mm[0.016in] to 1.5mm[0.059in]. Right?
Electronics Forum | Mon Mar 17 10:26:36 EDT 2014 | cwwong1
Pls share with me the time cycle result for the THM component on board thickness 93 mils, I would understand the risk for not having to achieve soler barrel fill less then 50%.
Electronics Forum | Mon Apr 21 10:50:13 EDT 2014 | cyber_wolf
The top PoP part is what gets dip fluxed or dip pasted. We have had warping issues with these components before but it is almost always the top part. My guess would be bad components if your reflow profile and print process is good to go.
Electronics Forum | Mon May 19 15:13:05 EDT 2014 | davef
Consider this combination: * IPC-7351B - Generic Requirements for Surface Mount Design and Land Pattern Standard * IPC Tools & Calculators [ipc.org/contentpage.aspx?pageid=PCB-Tools-and-Calculators ] * Component fabricator suggestions BR ... davef
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