Electronics Forum: component (Page 521 of 1144)

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 06:28:12 EDT 1999 | Earl Moon

| | snip | | | John and Dave, | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603'

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox

| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 09:33:11 EDT 1999 | Earl Moon

| | | | | | snip | | | | | | | John and Dave, | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do t

Re: Cracked Capacitors

Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW

| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf

V-Tek Tape and Reel Machines...

Electronics Forum | Thu Apr 22 13:43:14 EDT 1999 | Steve Gregory

Hey Ya'll! Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)cover t

Re: V-Tek Tape and Reel Machines...

Electronics Forum | Sun Apr 25 02:58:58 EDT 1999 | Haim H.

| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c

Re: Void in solder bump

Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.

| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard

Re: Questions regarding rework

Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F

1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu


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