Electronics Forum: component (Page 776 of 1144)

need new sm line

Electronics Forum | Fri Jun 25 13:00:48 EDT 2004 | haviland

Hi--We deal in used and recond. equipment in the Midwest, and have available a 1999 Amistar #7100FV w/ a nice complement of feeders, (6) pick up heads, rated component placement at 18,000 pph. Does .0402's, .3 BGA w/ 20 mil pitch, Full vision system,

PCB Manufacturer (SMT Technology) should read this

Electronics Forum | Wed Jun 16 21:56:04 EDT 2004 | rodionp

For those who are not sure as to what exactly we do, please get familiar with the article: http://www.reed-electronics.com/semiconductor/index.asp?layout=article&articleid=CA71291&industryid=3026 Which is PCB Assembly Optimization, what we do is we

Glenbrook Technologies X-Ray: Anyone using this??

Electronics Forum | Wed Jun 23 13:03:01 EDT 2004 | russ

I would ditto CAL, we have a jewel box 90 with the 5 axis and we love it. I really like being able to tilt,rotate,and move side to side front to back, Angle viewing under a BGA can be very informative as to the quality of reflow in seeing ball coll

Dispensing Paste for 0201-0402 uBGA devices?

Electronics Forum | Thu Jun 24 16:14:04 EDT 2004 | buki

I used an old camalot 1818 with solder paste dispener system to do 0402 components on LTCC. It worked very well, but there are tricks that you have to learn. Volume and placement of the dots is critical. I am sure the latest dispense equipment have s

Fuji CP6 Feeder Problems

Electronics Forum | Thu Jun 24 20:14:52 EDT 2004 | Alan

I know your frustration. CP6 feeders are notorious for this issue. They have always been an issue. You have probably went through the "change spring, change tape leaf, change component reel, place peeler tape over two rollers instead of three" scenar

Stencil / Pad design

Electronics Forum | Mon Jun 28 10:17:44 EDT 2004 | davef

People like flat surfaces for placing and reflowing certain components, like fine pitch devices. Some board suppliers can supply HASL that is flat and well controlled from an amount of material stand-point. Unlike OSP, HASL has a wonderful shelf-li

Long Soak Times for BGA soldering?

Electronics Forum | Thu Jul 01 23:56:06 EDT 2004 | rsthompson

I'm having a philisophical discussion with my boss regarding long reflow soak times to improve soldering under BGA devices. Is there anything to be gained by extending soak times at the 150C level from 60-90 seconds to 5-10 minutes? I've never seen

Why AOI. Features one should look while considering AOI

Electronics Forum | Tue Jul 06 17:10:19 EDT 2004 | Pete

Quality, consistency and labor savings all wrapped up into one nicely packaged piece of electro-mechanical marvel called AOI. Look for the number of templates one can store per component, lighting options, can it do through hole? Look at reporting

Palladium silver surface finish

Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy

Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t

Solid Solder Deposit

Electronics Forum | Sat Aug 07 17:27:00 EDT 2004 | celldude

We use ssd on all components, from 0201 to very large fine pitch and bga's. With some very small micro bga's , if there is a problem with bridging, we will tape off the stencil during the ssd process and just use bare pads...along with the solder fr


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