Electronics Forum: component (Page 901 of 1144)

Re: Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Fri Jun 16 11:28:53 EDT 2000 | Boca

Solder 'follows' heat. 1. Preheating is a great idea, use a baking oven to get the whole assembly up to temperature, use the preheaters in your wave solder machine (without wave) to preheat the assemblies ... 2. Or use the biggest soldering iron

Re: Underfilled CSP mechanical test

Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F

Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma

Re: Curing of Glue for SMT Components

Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea

Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b

Re: Soldermask Design Rules

Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F

0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would

Re: intrusive reflow with OA paste

Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca

I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem

Stacking chips

Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan

I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint

Re: Stacking chips

Electronics Forum | Tue May 16 05:45:46 EDT 2000 | Wolfgang Busko

Ashok: Couldn�t find that part in IPC-7711 either. I was just remembering that proposal from that thread mentioned. So you are still in that position I was at that time. Looking into IPC-D-275 (I have to admit that I have only an old issue in my offi

Damaged/dislodged components when doing second side of double sided reflow

Electronics Forum | Mon May 08 08:54:28 EDT 2000 | Lee Radney

Ok... Anybody got any quick, low cost ideas that can help me here? We run various panel layouts (all products are same width) thru our reflow oven. The problem is that due to the different layouts of our panels, the moveable center support chain

Re: Damaged/dislodged components when doing second side of double sided reflow

Electronics Forum | Mon May 08 12:02:14 EDT 2000 | Wolfgang Busko

The human machine is one of the most sophisticated know on this planet, "capable" of doing/thinking more than one task/thought at the same time. Sometimes the priorities get mixed up. So, if you have no simple computer or other gadgetry that�s able t

Re: The bent ones.......

Electronics Forum | Wed May 03 20:01:44 EDT 2000 | Dave F

Joe ... What is it with you and bent leads, bud??? One angle that you might take is taking to folk that reclaim components from stuffed, but obsolete boards. Try: Chip Pro 10390 E. Lakeview Drive #206 Scottsdale, AZ 85258 480-860-5790 Fax 8366 Pro


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