Electronics Forum: component (Page 916 of 1140)

Fountain Wave Soldering and Repair/Rework Equipment

Electronics Forum | Thu Jan 21 09:27:33 EST 1999 | Earl Moon

Hello, I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all the re

Re: Solder paste stencil modification

Electronics Forum | Fri Jan 15 08:43:43 EST 1999 | Mike McM

Bernie, If the pads are for a chip component and only about a half a pad off without anything else in the misregistered area, go ahead and use the stencil as is. Surface tension of the solder at liquidus should cause it to wick back to the pad, even

Re: Solder paste stencil modification

Electronics Forum | Wed Jan 20 20:29:17 EST 1999 | Tony A

| | Bernie, Steve Gregory approach is the simplest solution. But,If you ever get yourself into a real bind and need an array of holes added and the cost of a new stencil is astronomical. Approach Hamlet at BeamOn. I have seen him add and enlarge hole

Re: Reflow Temperature Labels/Stickers

Electronics Forum | Thu Jan 14 11:23:35 EST 1999 | Mike McMonagle

Reginald, McMaster-Carr Supply also carry them from a company called Thermographics (617-734-1018). I would caution agaist using them for anything except the simplest of measurements, there's a big difference between measuring your laminate s

Re: Why so little interest in Bulk Fed passives?

Electronics Forum | Tue Jan 05 18:18:56 EST 1999 | Hallj

| If passive componets are cheaper why aren't they more popular? Manufacturers like Murata and AVX claim availability and substantial cost savings but little interest seems to exist. Why? Your input is greatly appreciated. | I use bulk fed compon

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow

Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Re: Getting started

Electronics Forum | Mon Dec 28 14:49:45 EST 1998 | Earl Moon

| Where can I get information on analyzing the pros and cons of setting up a SMT line. I would also like to find information on what equipment is needed, manpower, cost, lead-times. | thanks | Ah Joann, The first thing you must know is don't trus

Re:X Y Correction at High Speed at +/- .002

Electronics Forum | Mon Dec 28 12:34:50 EST 1998 | Jon Medernach

Inorder to pick up 0402's RELIABLY correction is required in X & Y axis. Their are Chip Shooter that do this, (KME Create, and Sanyo) You can also place at +/- .002" at 43K cph with a Chip Shooter Bulk feeding is also desirable. It is not only the

Re: Solder Resist Solder balls - 'N Surface Energy

Electronics Forum | Tue Dec 22 17:12:26 EST 1998 | Dave F

| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,


component searches for Companies, Equipment, Machines, Suppliers & Information