Electronics Forum: component (Page 991 of 1144)

pad cratering

Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef

Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s

Conceptronic HVA102 request for help

Electronics Forum | Fri Jul 10 15:28:47 EDT 2015 | sumote

I could really use some help, My oven is continually blowing one of the SFC fuses (the one on the left as it sets in the machine) when the conveyor tries to run. It appears that the traces on the circuit card were having too much current pulled th

Can we check polarity and upside downs on My100?

Electronics Forum | Thu Jul 30 17:31:41 EDT 2015 | dyoungquist

We are running a Mydata (Micronic) MY15E. The MY100 is the next generation after the MYxxE series. As far as I know, there is no way for the machine itself to check the polarity of ICs to see if 1 or more are in the tube or reel different from all

What's the best company for low volume, quick turn around PCB assembly?

Electronics Forum | Fri Jan 08 03:56:38 EST 2016 | a290668789

there is no best company just the company best for you. E.g. I use PCBgogo(www.pcbgogo.com/b), they make PCB and also do PCBA, but they don't buy components for me. I don't like this at first and I prefer turn-key service, but why I still choose them

BGA pad design

Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk

In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t

Regarding BGA Pad Lifting

Electronics Forum | Wed Mar 01 02:10:05 EST 2017 | soldertraining

Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where t

Depaneling method

Electronics Forum | Fri Jun 03 10:11:08 EDT 2016 | tnisbet

If you end up buying a depaneling machine/robot, > the guys at Pentagon EMS are very good at making > fixtures. Once they have the specifications of > your machine all you will have to send them is > your panelized drawing of your board. In extre

Simultaneous pick up with 0402 and 0201 components

Electronics Forum | Fri May 06 08:27:38 EDT 2016 | kahrpr

We have Samsung and havehad no problems with simultaneous pick ups with 201s 0r 402s. the feeders are durable and do not need much repair especially the sm feeders. The SME feeders have not been out as long so we will see so far so good. As with all

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef

ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in

Having issues placing 0603 components on my used Juki 740...

Electronics Forum | Mon Jul 11 07:40:11 EDT 2016 | spoiltforchoice

I don't know your machine but you are looking at the most likely areas. Some machines define a placement pressure, other may define an overtravel to make sure the device is firmly placed on the board. There are usually also timings for when the vacuu


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