Electronics Forum: component interconnections (Page 1 of 5)

Intrusive reflow component selection

Electronics Forum | Mon Jul 10 11:38:15 EDT 2006 | Rob

Hi Dougs, I think I'm going to have to admit to some insider knowledge here. It kind of gave it away when you mentioned there were only catalogue pages instead of specs. http://www.anglia.com/product_search/part_tracker/index.asp I think you may

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

PWB strain specs?

Electronics Forum | Thu Jul 31 08:20:06 EDT 2008 | davef

Not quite what you'ree looking for, but may be interesting: JESD22B113, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products http://www.akrometrix.com/industrydocs/JESD22B113

Re: Surface mount on perf board

Electronics Forum | Wed Sep 02 17:29:51 EDT 1998 | Dave F

| How would you mount a surface mount chip onto Perf board? I am doing a project for school and one of the chips is a surface mount, but everything else fits in Perf board. Any suggestions? Thanks Matt: Here's one way to do it: 1 Get a hot glue

Who's heard about

Electronics Forum | Fri Aug 03 09:58:20 EDT 2007 | stepheniii

And that's better because? I think the guy that thought this up has never been to a board shop or knows what is involved with plating. Why does he think it's the board shops that will disappear? Maybe they will simply build the board over the compon

Electronic Components Distributors

Electronics Forum | Sat Jan 07 04:00:12 EST 2017 | soldertraining

Electronic components distributor offering semiconductors, interconnects, electro-mechanical, power supplies, PCB Repair, BGA rework and measurement equipment. In order to select the electronic distributor we must remain updated with Technology news

Very high interconnect density

Electronics Forum | Wed Sep 29 17:36:02 EDT 1999 | Earl Moon

We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control and

solder ball problem in manual soldering

Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch

Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b

BGA attach eval.

Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf

I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro

No Clean and Underfill

Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef

Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.

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